SK Hynix is moving aggressively to ease the global shortage of high-bandwidth memory (HBM) by building a brand-new production facility named P&T7. With AI hardware demand accelerating and HBM supply remaining tight, the company is positioning this site as a major pillar of its next-generation AI memory strategy.
The P&T7 facility is being built at the Cheongju Technopolis Industrial Complex and is designed to support both HBM memory output and advanced processes that help bring these products to market faster. In addition to boosting HBM-related capacity, the site will include wafer-level packaging (WLP) lines, an increasingly important step in modern memory manufacturing as AI accelerators demand higher performance, better efficiency, and denser integration.
SK Hynix formally marked the project with a groundbreaking ceremony attended by around 125 executives and employees. During the event, the company emphasized that P&T7 is intended to strengthen its leadership in AI memory. SK Hynix also highlighted a dual focus: producing cutting-edge memory products that can help define global AI infrastructure standards, while working closely with the local community to support regional growth.
Construction and rollout timelines have also been outlined. The WT (wafer test) line is targeted for completion by October 2027, while the WLP (wafer-level packaging) line is expected to be completed by February 2028. SK Hynix says all production lines are set to commence by 2028, aligning with the period when demand for AI-focused computing hardware is expected to remain extremely high.
The sheer scale of P&T7 underlines how serious the company is about expanding capacity. The facility will span about 230,000 square meters—roughly comparable to 32 to 40 soccer fields. Inside, three floors are planned for WLP processes across about 60,000 square meters, while seven floors will be dedicated to WT lines across about 90,000 square meters. That combination suggests a major emphasis not only on producing advanced memory, but also on testing and packaging capabilities that can help improve throughput and time-to-delivery.
SK Hynix also provided details on the workforce behind the buildout. The company expects an average of 320 workers on site per day during construction, rising to as many as 9,000 at peak periods. After construction is complete, around 3,000 in-house personnel are expected to be stationed at P&T7 to support ongoing operations.
Beyond memory supply, the project is expected to bring economic and infrastructure benefits to the surrounding area. SK Hynix anticipates that the facility will help drive expansion of nearby infrastructure, including transportation networks, and contribute to improved living conditions for local residents as development around the complex grows.
The timing of the P&T7 announcement is notable as competition in the HBM market continues to intensify. Industry chatter increasingly points to SK Hynix strengthening its position versus key rivals, with expectations that the company is maintaining momentum in both development and production of cutting-edge HBM designs. By adding a large-scale new facility focused on the manufacturing, testing, and packaging steps needed to deliver HBM products, SK Hynix aims to improve supply for AI customers while enabling faster adoption of next-generation HBM technologies.
For anyone tracking AI infrastructure, GPUs for machine learning, and the future of data-center buildouts, P&T7 is a clear signal: SK Hynix is investing heavily to secure HBM capacity and stay at the front of the AI memory race through 2028 and beyond.
