SK hynix is preparing to bring one of the most in-demand parts of modern chipmaking closer to key customers by reportedly planning a 2.5D advanced packaging facility in the United States. The move could help strengthen the domestic semiconductor supply chain and expand SK hynix’s ability to deliver high-bandwidth memory (HBM) for today’s AI and accelerated computing boom.
Advanced packaging has become a major bottleneck in the global chip industry, and it’s especially critical in the US market. While the country has seen major semiconductor investment in recent years, there’s still a notable gap in widely available, mainstream advanced packaging capacity. That matters because leading-edge chips increasingly rely on technologies like 2.5D packaging to combine multiple components into a single high-performance package.
According to a report cited by Korean media, SK hynix is looking at Indiana as the location for a new 2.5D packaging plant. The goal is to scale HBM production and make it easier to serve US-based demand. This is particularly important as HBM modules remain in extremely high demand, driven by AI hardware needs across the industry.
2.5D packaging plays a central role in how HBM is used in modern systems. It enables HBM stacks to sit alongside a processor on a silicon interposer, creating the high-speed, high-bandwidth connections needed for AI training and inference workloads. In many deployments, these HBM stacks have been paired with advanced packaging solutions provided through external manufacturing ecosystems, but supply constraints and limited domestic availability have made packaging capacity a growing concern. For SK hynix, having packaging capability in the US could reduce reliance on overseas routes and help ensure steadier deliveries to major customers, including NVIDIA and other high-performance computing players.
The report also indicates SK hynix is not expected to operate such advanced packaging facilities entirely on its own. Instead, the company is likely exploring partnerships or a joint venture structure, since running large-scale 2.5D packaging lines requires specialized expertise, equipment, and operational know-how. While no specific partner names were confirmed, potential routes could include established outsourced packaging specialists already expanding in the US, or a collaboration with a major US-based manufacturing ecosystem that can offer an alternative advanced packaging approach.
If SK hynix follows through, the expansion would not only help the company respond faster to surging HBM demand, but also add more advanced packaging capacity within the US—an area many in the industry see as essential for a more resilient semiconductor supply chain.
