NVIDIA is reportedly eyeing a new packaging solution called CoWoP for its upcoming Rubin GPUs, potentially moving away from the traditional CoWoS technology that has been a staple for high-performance computing and AI chips for over a decade.
CoWoS, which stands for Chip-on-Wafer-on-Substrate, has been widely adopted by industry giants like NVIDIA and AMD, thanks to its established supply chain and proven reliability. However, a recent roadmap leak suggests NVIDIA might be exploring CoWoP, or Chip-on-Wafer-on-Platform, as an alternative. This approach eliminates the package substrate, connecting the interposer directly to the motherboard.
CoWoP offers several advantages, including improved signal and power integrity due to the absence of substrate losses, and enhanced thermal performance by allowing direct contact between the thermal solution and the silicon. Additionally, it offers potential cost reductions by doing away with the package and lid altogether.
NVIDIA’s early tests with CoWoP began with the GB100 GPU, featuring a dummy GPU/HBM solution. This phase aims to evaluate process flow selection and is taking place this month. By the following month, NVIDIA plans to test a functional GB100 CoWoP unit to assess manufacturability, structural and electrical functionality, thermal design, and NVLINK interface throughput. These tests, however, will remain internal and not involve external customers.
Looking ahead, NVIDIA intends to test its Rubin chips with CoWoP next year, setting the stage for a production-ready GR150 “Rubin” solution by late 2026, aiming for market availability in 2027. Despite this potential shift, CoWoS is expected to remain in use alongside CoWoP.
However, transitioning to CoWoP involves challenges, such as the initial costs of adopting new technology and setting up the necessary supply chain. This shift could also lead to increased complexity and design alterations for motherboards, potentially driving up costs and creating production bottlenecks.
While some market analysts remain skeptical about NVIDIA’s adoption of CoWoP for its next-gen GPUs, the decision will largely depend on market trends and supply-demand dynamics. As we await the Rubin GPU’s debut, both CoWoP and CoWoS continue to hold significant roles in NVIDIA’s future plans.
