In June, a trademark filing revealed Xiaomi’s intentions to launch the XRING 02, signaling a rapid transition from its predecessor, the XRING 01. The latest buzz suggests the company is set to escalate its innovation efforts by introducing its first in-house 5G modem with its custom silicon, aiming to reduce dependency on established players like Qualcomm and MediaTek.
While specific details about the production process remain unclear, there’s speculation that if U.S. export restrictions loosen, Xiaomi could potentially harness TSMC’s advanced 2nm technology for the XRING 02.
This rumor, originating from Weibo’s Smart Pikachu, indicates Xiaomi’s ambition to integrate a new 5G baseband SoC with the XRING 02. Currently, the XRING 01 incorporates MediaTek’s T800 5G modem as a separate component, which is not the most efficient use of space and power in a flagship device. The upcoming XRING 02’s integrated modem could pave the way for larger batteries or other enhancements while improving energy efficiency. Moreover, Xiaomi stands to benefit cost-wise by developing its own silicon, although the initial stages of this endeavor are undoubtedly challenging.
The introduction of Xiaomi’s self-developed 5G modem marks a significant milestone. Creating such technology from the ground up is a complex task—something even tech giant Apple found demanding with its C1 modem project. Yet, Xiaomi seems poised to take a more economical path, aiming for high performance with controlled investment.
Looking beyond smartphones and tablets, the XRING 02 is rumored to make its way into Xiaomi’s automotive technology. Given the regulatory hurdles and necessary verifications, the rollout of this second-generation SoC might take some extra time. Whether Xiaomi will utilize TSMC’s 2nm process could depend on future geopolitical shifts affecting export controls.
Stay tuned as Xiaomi continues to push the boundaries of its technological capabilities with the XRING 02.
