Xiaomi is making significant strides with its technological innovation by developing its first in-house 3nm chipset, the XRING 01. This development marks a strategic shift away from reliance on partners like Qualcomm and MediaTek. However, the success of this strategy hinges on the continuous evolution of Xiaomi’s custom SoCs. Excitingly, it appears that work on the next iteration, the XRING 02, is already underway. A recent leak has revealed that Xiaomi has filed trademarks not only for XRING 02 but also for XRING T1 and XRING 0.
Images shared by a credible source suggest that the XRING 02 trademark has been registered on TianYanCha, a well-known Chinese platform. Notably, XRING T1, used in the Xiaomi Watch S4, and XRING 0 have also been trademarked, underscoring Xiaomi’s commitment to developing more advanced chipsets.
The XRING 01, built on TSMC’s second-generation 3nm process, indicates that its successor, the XRING 02, might leverage TSMC’s more advanced third-generation 3nm node, known as ‘N3P’. Depending on development timelines, Xiaomi might even leap to 2nm technology. Nonetheless, challenges loom, particularly due to U.S. restrictions on essential EDA tools for semiconductor advancement, which hinders Xiaomi’s ability to utilize the 2nm process for the XRING 02.
Despite these challenges, Xiaomi might adopt TSMC’s 3nm N3E process. While this remains a cutting-edge approach, the XRING 02 could face competition from Qualcomm’s Snapdragon 8 Elite Gen 3 and Apple’s A20 series, both of which are rumored to transition to the 2nm node. However, since Xiaomi is not currently on Taiwan’s export control list, it retains the possibility of importing essential tools, provided it secures the necessary licenses. This means the XRING 02 might still hold its ground against rival technologies.
As developments continue, it’s clear that Xiaomi is poised for an exciting tech journey. Stay tuned for further updates as more information becomes available.
