A cloud of anticipation surrounds TSMC’s ambitious journey toward delivering its first wave of 2nm wafer shipments, primarily aimed at high-value clients. The plan hinges on how rapidly TSMC can enhance its production yields. Previously, reports indicated that the company’s trial production of this advanced lithography had achieved an impressive 60 percent success rate. This milestone cements TSMC’s leadership in the semiconductor industry. Recently, an analyst suggested that since this yield figure was reported, the production process might have improved sufficiently to contemplate full-scale manufacturing.
While precise yield numbers remain undisclosed, the 60 percent yield from the 2nm trial run was noted as being three months old. TSMC’s first customer for the 2nm process is expected to be Apple. Analyst Ming-Chi Kuo theorized that Apple’s upcoming iPhone 18 series, slated for the latter part of 2026, will likely feature a new chipset manufactured using this advanced technology. Previously, Jeff Pu from GF Securities had speculated that the A20 chip for Apple would be produced using TSMC’s 3nm ‘N3P’ node. However, he has since revised his forecast to align with Kuo’s insights.
Initially, it was suggested that not all models within the iPhone 18 lineup would incorporate the 2nm A-series SoC due to high production costs. This projection seemed based on TSMC’s earlier progress with its cutting-edge technology. Given that the 60 percent yield mark was achieved around three months ago, Kuo believes advancements in TSMC’s processes may have brought production levels to a viable commercial scale. It is anticipated that TSMC could produce up to 50,000 of these 2nm wafers by the end of 2025.
Once both the Baoshan and Kaohsiung facilities are fully operational, production might reach 80,000 units, potentially meeting demands for the 2nm technology. TSMC is also working on cost-reduction strategies for each wafer, possibly enticing other companies beyond Apple to invest in the 2nm process. In a bid to cut expenses, TSMC plans to launch its ‘CyberShuttle’ service in April, allowing customers to test their chips on a shared wafer. This initiative might attract a broader clientele, thereby solidifying TSMC’s dominance in the foundry market.
