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TSMC CoWoS Supplier Sues Former GM, Insists No Advanced Packaging Know-How Was Shared With China

Grand Process Technology Corporation (GPTC), a major supplier supporting TSMC’s advanced packaging efforts, says it has found no evidence that sensitive technology was leaked to China, pushing back against rumors that recently gained traction.

GPTC is closely tied to TSMC’s next-generation chip packaging ecosystem, supplying equipment used in advanced packaging processes that support high-performance computing and AI-focused chips. With demand for advanced packaging—especially solutions linked to CoWoS—continuing to surge, any claim involving trade secret leakage naturally draws intense attention across the semiconductor industry.

In its public statement, GPTC said internal checks did not uncover signs that key technology had been transferred to China. The company’s position is that, based on what it has observed so far, there is no indication that confidential know-how, equipment, or machinery tied to critical processes made its way across borders. In other words, GPTC is directly rejecting the idea that its core technology ended up in China as a result of any confirmed leak.

At the same time, GPTC has also taken legal action against its former General Manager, Huang Fu-Yuan. The company alleges Huang is connected to suspected trade secret infringement. According to GPTC, the matter has moved into the judicial investigation stage, and it says legal restrictions prevent it from sharing further details while the process is ongoing.

GPTC also stated it is cooperating with prosecutors and investigators as the case proceeds, emphasizing that it is working to protect the company’s rights and interests. It additionally reminded employees to comply with company rules and relevant regulations—language that typically signals a firm tightening of internal compliance expectations during a sensitive investigation.

The combination of a public denial of a China-related leak and a lawsuit involving suspected trade secret infringement is likely to keep the story in the spotlight. Even if current findings suggest no confirmed transfer of key confidential technology, an investigation involving a former top executive raises fresh questions about what triggered the complaint and what investigators may be examining behind the scenes.

The case also unfolds amid heightened geopolitical pressure on the chip industry. China has faced multiple trade restrictions from the US government, and the broader semiconductor supply chain has become more guarded about advanced manufacturing and cutting-edge packaging expertise. Reports of efforts to recruit experienced talent from leading chip firms have only amplified concerns about knowledge transfer, particularly in areas that are pivotal for producing advanced chips.

For now, GPTC’s official message is clear: it has not found evidence of key technology leakage to China, and it is pursuing legal avenues to address suspected trade secret violations involving a former executive while cooperating fully with authorities.