Solidigm is taking a bold step in enterprise storage with the D7-PS1010, an E1.S SSD that swaps traditional fans for a direct-to-chip liquid cooling system. Designed for high-density AI and GPU servers where airflow is limited and energy budgets are tight, this cold-plate-cooled eSSD aims to deliver superior thermals, higher reliability, and better rack-level efficiency.
At the heart of the design is a single-sided cold plate that effectively cools both sides of the SSD’s components. By channeling coolant directly through a plate that contacts the chips, the drive sidesteps the need for fans, reduces power draw, and frees up valuable space. That combination can help data center operators pack more GPUs or storage into each rack while maintaining consistent performance under sustained workloads.
Solidigm positions the D7-PS1010 for AI-heavy environments and hyperscale data centers, where thermal control, density, and predictable performance are non-negotiable. The compact E1.S form factor already suits modern server designs, and removing additional cooling hardware further boosts integration flexibility.
Key highlights
– Direct-to-chip liquid cooling with a single-sided cold plate that cools both sides of the SSD
– Fanless operation for improved energy efficiency and reduced acoustic and mechanical complexity
– E1.S form factor with 9.5 mm and 15 mm thickness options
– Capacities of 3.84 TB and 7.68 TB for enterprise deployments
– PCIe 5.0 interface for next-generation bandwidth and responsiveness
– Claimed best-in-class 4-corners storage performance among E1.S Gen 5 SSDs, targeting consistent results across mixed read/write and sequential/random workloads
– Ecosystem collaboration with major server ODMs and OEMs to streamline qualification and deployment
Industry partners are already leaning in. Supermicro highlighted that the cold-plate-cooled E1.S can be integrated into advanced liquid-cooled architectures, including NVIDIA HGX B300-based GPU servers that drive compute-intensive AI workloads.
Why this matters
– Better thermals without bulky fans: Liquid cooling removes heat more efficiently, helping sustain peak performance.
– Higher rack density: Freeing up space and power previously dedicated to fans enables more GPUs or SSDs per rack.
– Lower operating costs: Reduced power consumption and simplified cooling can improve total cost of ownership.
– Ready for AI-scale infrastructure: Designed specifically for environments where heat and density are the main bottlenecks.
With the D7-PS1010, Solidigm is bringing liquid cooling directly to the storage layer—an approach that aligns with the broader shift toward liquid-cooled data centers. For operators building out AI clusters and high-performance computing infrastructure, this eSSD offers a path to higher density and more consistent performance without the thermal compromises of traditional fan-based designs.
