Samsung Electronics has reached a significant milestone by developing its sixth-generation 1c DRAM, crafted using an advanced 10nm class process. This achievement comes as the product receives internal Production Readiness Approval (PRA), indicating it has passed crucial quality and performance standards and is well on its way to mass production. This progress brings Samsung closer to launching its fourth-generation high-bandwidth memory, HBM4, anticipated for the second half of 2025.
According to South Korean media, the PRA clearance is a noteworthy technical and strategic advancement. It confirms that the DRAM has successfully passed internal evaluations and is set for large-scale production. Since Jun Young-Hyun took the helm of Samsung’s Device Solutions division in 2023, the company has intensified its focus on enhancing DRAM competitiveness. This involves innovative design enhancements and the adoption of new materials and fabrication techniques, like dry photoresists, to boost production efficiency.
Samsung’s prior introduction of its fifth-generation 1b DRAM in December 2022, followed by mass production in May 2023, highlights a rapid advancement with the development of the 1c DRAM just two years later. This reflects Samsung’s determination to remain a leader in memory innovation. Plans are underway to phase out older DRAM generations in favor of the new 1c chips, aiming to increase production volume. The company is also engaging with key suppliers to finalize deals for the new DRAM production line.
The 1c DRAM is poised to be the cornerstone for Samsung’s upcoming HBM4, projected for large-scale manufacturing in late 2025. This is a crucial area for high-performance computing and AI, where HBM memory is vital. Rival SK Hynix is developing its HBM4 using the preceding 1b DRAM and began shipping samples to customers in March 2025. The race to bring HBM4 to market by late 2025 is intensifying, and Samsung’s choice to use the more advanced 1c DRAM is seen as a strategic effort to reclaim market leadership.
Building on its recent success supplying AMD with 12-layer HBM3E chips, Samsung is now negotiating future supply deals with NVIDIA and is in talks with various clients for specialized HBM4 solutions. Analysts predict that HBM4 will start significantly contributing to Samsung’s revenue by 2026.
