Doosan Develops Ultra-Thin Copper-Clad Laminate for Next-Generation Memory Chip Packaging
Doosan Corporation’s Electro-Materials BG has made a notable advancement in semiconductor packaging materials by developing a thinner copper-clad laminate technology designed for memory semiconductor package substrates.
The new copper-clad laminate, commonly known as CCL, reduces the prepreg insulating layer used in memory chip substrates from around 18 micrometers to just 13 micrometers. While the difference may sound small, in advanced semiconductor packaging, every micrometer matters. A thinner insulating layer can help manufacturers create slimmer, more compact, and potentially higher-performance memory packages.
Copper-clad laminate is a key material used in package substrates, which act as the connection layer between semiconductor chips and the broader electronic system. As demand grows for faster, thinner, and more energy-efficient devices, the materials used inside chip packages are becoming increasingly important. Smartphones, AI servers, high-performance computing systems, and advanced consumer electronics all depend on memory components that are compact, reliable, and capable of handling growing data workloads.
By reducing the thickness of the prepreg insulating layer, Doosan’s latest CCL technology could support more advanced package designs. Thinner materials can allow greater design flexibility for semiconductor manufacturers, especially as memory chips continue to evolve toward higher density and smaller form factors.
The development also reflects the broader industry push toward miniaturization in semiconductor packaging. As chipmakers work to stack, connect, and package more components within limited space, substrate materials must deliver both thinness and reliability. Maintaining insulation performance while reducing thickness is a technical challenge, making this advancement important for the next stage of memory package substrate production.
Doosan is now preparing the new material for mass production, signaling that the technology is moving beyond the development stage and closer to commercial use. If successfully scaled, the thinner CCL could become part of future memory semiconductor packaging solutions used in a wide range of electronics.
This progress highlights the increasing role of advanced materials in the semiconductor supply chain. While chip performance often receives the most attention, improvements in substrates, laminates, and insulation layers are just as critical to enabling smaller and more powerful electronic devices.
With its 13-micrometer prepreg insulating layer technology, Doosan aims to strengthen its position in the market for high-performance semiconductor packaging materials. As demand for next-generation memory continues to rise, innovations in copper-clad laminate could play an important role in shaping the future of compact and efficient chip design.
