Doosan Announces KRW968.4 Billion Expansion to Boost High-End Copper-Clad Laminate Production
Doosan is making its biggest investment yet in the copper-clad laminate business, committing KRW968.4 billion, or about US$701 million, to expand production capacity in South Korea and China. The move comes as demand for advanced electronic materials continues to surge, driven by the rapid growth of artificial intelligence infrastructure and high-performance networking equipment.
Copper-clad laminate, commonly known as CCL, is a key material used in printed circuit boards. As AI accelerators, network switches, and optical modules become more powerful and complex, manufacturers require higher-quality substrates that can support faster speeds, improved reliability, and stronger thermal performance. This rising demand has placed heavy pressure on existing production lines, with major facilities now operating beyond full utilization.
Doosan’s large-scale investment is designed to strengthen its ability to supply high-end CCL products for next-generation electronics. By expanding operations in both South Korea and China, the company aims to support customers across fast-growing technology sectors where stable component supply has become increasingly important.
The timing of the investment reflects a broader shift in the global electronics supply chain. AI data centers, cloud computing systems, advanced communications networks, and optical transmission equipment are all increasing the need for premium printed circuit board materials. As a result, companies that can produce advanced CCL at scale are becoming more critical to the technology manufacturing ecosystem.
Doosan’s expansion could help ease supply constraints in a market where demand is outpacing available capacity. With AI hardware adoption accelerating worldwide, the need for high-performance materials is expected to remain strong. The company’s KRW968.4 billion commitment positions it to capture more growth from the expanding AI and networking hardware markets while reinforcing its role in the advanced materials sector.
This investment marks a major step for Doosan as it responds to rising global demand for copper-clad laminates used in high-speed, high-density electronic applications. As production capacity increases, the company is expected to play a larger role in supporting the infrastructure behind artificial intelligence, data transmission, and next-generation digital connectivity.
