ASUS has recently dropped hints about AMD’s forthcoming Ryzen 9000X3D CPUs that are expected to feature the next-gen Zen 5 cores and innovative 3D V-Cache technology. Amidst unveiling new X870E and X870 chipset motherboards, ASUS’s webpage source code inadvertently revealed details about these anticipated processors slated for the AM5 platform.
Intriguingly, the source code of ASUS’s microsite indicated the existence of Ryzen 9000X3D chips, in addition to listing various chipset motherboards. Despite just having launched the first four Ryzen 9000 CPUs, this discovery points towards an expansion of the series with the addition of 3D V-Cache technology. This is not surprising as AMD has previously shown enthusiasm in creating X3D models of their Zen 3 and Zen 4 CPU lineups.
Discovered by an eagle-eyed observer who scrutinized the source code of ASUS’s motherboard page, the URL hinted at more than just X870E and X870 chipset motherboards, specifically mentioning ‘Ryzen 9000X3D’. Upon deeper exploration by the team at ComputerBase, the page description within the source code revealed:
ASUS AMD X870E and X870 motherboards are crafted for peak performance with AMD Ryzen 9000 series X3D processors, gearing them towards Advanced AI PCs. These motherboards boast AI technologies, PCIe 5.0, DDR5 support with NitroPath DRAM and AEMP technologies, USB4 40 Gbps Type-C, WiFi 7, and user-friendly PC DIY designs.
This information strongly suggests that ASUS, and likely other AMD partners, are well-informed about these new CPUs, which are poised to offer increased L3 cache memory. While exact launch dates remain under wraps, and AMD has yet to comment on these particular processors, the addition of 3D V-Cache technology to Ryzen 9000 CPUs is bound to enhance performance significantly, especially in video games, based on the precedent set by previous generations.
Notably, a Ryzen 5 5500X3D recently appeared in an EEC filing, with leaks also pointing towards an upcoming Ryzen 5 7600X3D. Although there are no 3D CPUs currently in the Ryzen 9000 lineup, it appears AMD is preparing to release a new batch of 3D CPUs shortly. Past speculations suggested an October release, coinciding with the appearance of AMD’s 800-series motherboards. Furthermore, it was previously reported that Ryzen 9000X3D CPUs would support overclocking, feature sizable cache memory, and benefit from the Zen 5 IPC gains.
Anticipate the L3 cache in CPUs like Ryzen 9600X and 9700X to soar by at least 64MB, resulting in a total of 96MB L3 cache. However, be prepared for potential lower clock speeds due to the unique stacking technique. The X3D chips are typically more power-efficient and perform well in gaming scenarios with less energy consumption. Ryzen 9000X3D chips should offer significant performance boosts, warranting consideration over existing models like the 7800X3D or the soon-to-come 7600X3D.
This buzz around these powerful processors with enhanced cache capacities has stirred excitement among tech enthusiasts and signals a new leap in CPU performance for users. Keep an eye out for more updates as the world waits for the official launch from AMD.
