Next year marks a significant leap in technology as the first 2nm chipsets are set to make their debut, with Apple likely at the forefront by introducing them in the iPhone 18 series under the names A20 and A20 Pro. This advancement not only showcases TSMC’s cutting-edge manufacturing process but also heralds a shift in Apple’s packaging techniques anticipated for 2026. Reports suggest Apple will adopt WMCM (Wafer-Level Multi-Chip Module) packaging for these chipsets, while TSMC’s SoIC (System on Integrated Chips) technology will be used for Apple’s server chips.
To facilitate this, TSMC is planning two dedicated production facilities, named P1 and AP6, specifically for Apple’s A20 and server chips. WMCM packaging is set to revolutionize the A20 and A20 Pro by allowing the integration of multiple components such as the CPU, GPU, and memory at the wafer level. This results in a compact, efficient design perfect for mass-producing smaller and more efficient System-on-Chips (SoCs).
A report indicates TSMC’s Chiayi P1 plant will focus on WMCM, initially targeting 10,000 wafers per month. While it remains unclear if other companies will adopt this technology, Apple is keenly interested in its server chips. Unlike the A20 and A20 Pro, these will use TSMC’s SoIC packaging, which involves stacking chips to create ultra-dense connections. This method promises reduced latency, enhanced performance, and improved efficiency.
Both Apple and TSMC have been exploring the potential of SoIC packaging, which might soon be seen in future iterations of the M5 Pro and M5 Max. The scalability of SoIC server chips is promising, with large-scale production set to commence at TSMC’s Zhunan AP6 facility by the end of 2025.
