TSMC has reportedly begun accepting orders for its innovative 2nm wafers, though the first chipsets using this advanced technology are anticipated to hit the market by the end of next year. Apple is expected to be among the first to leverage this advancement, with its rumored A20 chip set to harness the power of the 2nm process. It’s said that Apple will also integrate TSMC’s Wafer-Level Multi-Chip Module (WMCM) packaging into the A20, which could mean significant gains for users opting for devices like the upcoming iPhone 18 Pro, iPhone 18 Pro Max, or Apple’s anticipated foldable phone.
By adopting WMCM packaging, Apple could maintain the A20’s compact size while achieving greater flexibility in component integration. This means that elements like the CPU, GPU, and memory can be combined at the wafer level before being cut into individual chips. This process is expected to enhance power efficiency and performance, offering an impressive ‘performance per watt’ metric.
According to China Times, the A20 will enhance the iPhone 18 Pro, iPhone 18 Pro Max, and the speculated iPhone 18 Fold. TSMC’s dedicated production line for these WMCM chipsets will be in Chiayi AP7, with an estimated monthly capacity of 50,000 units by late 2026. Interestingly, despite the technological advancements, Apple will reportedly keep the RAM at 12GB, the same as its predecessors.
While it’s unclear if the more budget-friendly iPhone 18 variants will feature the WMCM technology or stick with the older Integrated Fan-Out (InFo) packaging to cut costs, these details are expected to be revealed when the iPhone 18 series officially launches in the fourth quarter of 2026. Stay tuned for more updates.
