Powertech Technology, a major player in memory packaging, is making an aggressive push into fan-out panel-level packaging (FOPLP) as demand for AI hardware accelerates and the semiconductor industry faces ongoing memory shortages. The company’s leadership believes the momentum behind artificial intelligence will keep driving the need for advanced packaging solutions, putting Powertech in a strong position to capture new business over the next few years.
Chairman Duh-Kung Tsai has expressed clear optimism about the AI industry’s trajectory, pointing to the expanding requirements for high-performance chips and the packaging technologies needed to support them. As chipmakers and system builders scramble to secure capacity for advanced packaging, Powertech is moving quickly to scale FOPLP—an approach increasingly viewed as an important next step for improving efficiency and output in chip packaging.
A central part of Powertech’s strategy is to become the leading packaging partner outside the TSMC ecosystem. With many customers looking to diversify suppliers and reduce dependency on a single manufacturing network, Powertech is positioning its growing FOPLP capabilities as a compelling alternative for companies that need reliable, high-volume advanced packaging.
The big payoff is expected in 2027 and 2028, when Powertech anticipates its FOPLP capacity will be fully utilized. At that point, the company forecasts a major jump in revenue, with FOPLP contributing around NT$3 billion (about US$95 million) per month. If those targets are met, it would mark a significant milestone not only for Powertech’s growth, but also for the wider shift toward panel-level advanced packaging driven by AI demand and tightening supply across the memory and semiconductor markets.
