SK hynix is setting a new benchmark in the world of memory technology with the mass production of its groundbreaking 12-layer HBM3E memory. This advancement is poised to usher in a new era of AI computing, demonstrating SK hynix’s relentless drive to push the boundaries of innovation.
In a significant leap, SK hynix has begun volume production of the world’s first 12-layer HBM3E product, boasting a remarkable 36GB capacity—the largest ever in High Bandwidth Memory (HBM). This achievement follows closely on the heels of the company’s milestone earlier this year when it delivered an 8-layer HBM3E product to customers in a pioneering move.
This new 12-layer HBM3E memory isn’t just about capacity; it’s engineered to meet the highest standards in speed, capacity, and stability essential for artificial intelligence. With an impressive memory operation speed of 9.6 Gbps, the highest recorded to date, these new modules set a new performance benchmark. For example, if a single GPU equipped with four of these HBM3E units powers an AI model like Llama 3 70B, it can scan a vast dataset of 70 billion parameters 35 times per second, showcasing unparalleled efficiency.
Justin Kim, the President and Head of AI Infrastructure at SK hynix, reflects on this milestone, emphasizing the company’s determination to lead the AI memory market. He highlights that this latest breakthrough reinforces SK hynix’s status as a premier provider in the global AI memory space and signals their ongoing commitment to developing next-generation memory solutions.
To achieve this 50% increase in capacity, SK hynix employed innovative stacking techniques. They managed to stack 12 layers of 3GB DRAM chips without increasing the overall thickness by making each chip 40% thinner. This precision stacking was accomplished using TSV (Through Silicon Via) technology and their proprietary Advanced MR-MUF process. Notably, this design tweak also boosts heat dissipation performance by 10%, ensuring the stability and reliability of the memory even under demanding conditions.
This development not only highlights SK hynix’s technological prowess but also signifies a critical enhancement in AI computing capabilities, promising better performance and reliability. As the tech landscape continues to evolve, innovations like this from SK hynix are paving the way for more advanced and efficient AI solutions.
