TSMC to bump 2nm wafer production to 60,000 units in 2026

TSMC’s 2nm Fab Surge: Four Plants to Hit Full Capacity, 60,000 Monthly Wafers Expected—but No Customer Relief in Sight

Next year promises to be a game-changer in the tech industry with the launch of the first 2nm chipsets by multiple companies. TSMC is set to lead the charge, gradually increasing production after beginning to accept orders in April. This transition will involve operations across four facilities, with a projected output of 60,000 units monthly. However, this cutting-edge technology will come at a premium, posing a significant investment for customers looking to leverage it by 2026.

Despite gearing up for full-scale 2nm production, TSMC doesn’t plan to offer discounts, with each unit being around 50% more costly than the 3nm version. With trial yields at 60%, the company is poised for large-scale manufacturing, attracting industry giants like Apple, Qualcomm, and MediaTek. According to reports, four plants in Kaohsiung and Hsinchu will spearhead this production. The P1 facility is already in mass production, churning out 10,000 wafers monthly.

The P2 facility is progressing, with equipment installations underway and pilot production slated to start shortly, targeting a maximum capacity of 30,000 units per month. In Hsinchu, the P1 plant has moved past trial stages, ready to commence mass production. Lines at the P2 site are also being set up, aiming for a collective output of 30,000 to 35,000 units monthly.

Anticipated to reach a total of 60,000 units, buyers will face a steep cost of $30,000 per unit. To mitigate these expenses, TSMC has introduced the ‘CyberShuttle’ service, allowing companies like Apple to test their silicon on shared wafers, potentially reducing costs. Meanwhile, Samsung’s announcement of the Exynos 2600, its first 2nm GAA SoC, might pressure TSMC to reconsider pricing if Samsung boosts its production efficiency and yields.