TSMC accelerates 1.4nm ambitions with ‘Fab 25’ as 2nm enters mass production in 2025
TSMC is pushing deeper into angstrom-class manufacturing even before its 2nm node hits high-volume production. While 2nm mass production is slated for the fourth quarter of 2025, the company is moving ahead of schedule on a new facility dedicated to its 1.4nm process, also referred to as A14 or Angstrom. Construction is set to begin as early as October, backed by an initial investment that could reach NT$1.5 trillion (about $49 billion), underscoring a drive to extend its lead in advanced chipmaking.
According to reports, the new complex—internally dubbed Fab 25—will rise inside the Central Taiwan Science Park near Taichung City. The site will ultimately host four manufacturing plants, with the first line targeted to begin trial production of 1.4nm chips by the end of 2027. Suppliers have reportedly been notified to prepare critical tools and materials so equipment deliveries can be pulled forward if needed.
If the current timetable holds, full-scale 1.4nm production could follow in the second half of 2028. Early projections point to around 15 percent higher performance and up to 30 percent lower power consumption versus the prior generation, gains that are expected to resonate with power-sensitive and high-performance markets alike. The remaining three plants at Fab 25 are also planned for 1.4nm output, and the company is already eyeing a future 1nm milestone, though no trial dates have been indicated.
Next-generation manufacturing won’t come cheap. With 2nm wafers estimated around $30,000 each, early estimates suggest 1.4nm could climb to roughly $45,000 per wafer. That pricing reflects the complexity and capital intensity of angstrom-era production, but also the potential payoff for customers chasing performance-per-watt leadership.
Key milestones and details
– 2nm mass production: Q4 2025
– Fab 25 location: Central Taiwan Science Park, near Taichung City
– Fab 25 scope: Four plants focused on 1.4nm (A14) manufacturing
– 1.4nm trial production: Targeted by end of 2027
– Potential volume production: As early as H2 2028
– Projected benefits: About 15% performance uplift and up to 30% power savings
– Estimated wafer pricing: Around $45,000 for 1.4nm vs. roughly $30,000 at 2nm
– Investment outlook: Up to NT$1.5 trillion (about $49 billion)
– Longer-term roadmap: 1nm under exploration, timing yet to be disclosed
With 2nm nearing the finish line and 1.4nm fast-tracked, TSMC is laying the groundwork for the next wave of ultra-dense, energy-efficient chips. Expect more details as construction progresses and trial runs approach.
