Qualcomm sticks with TSMC and Samsung as Intel Foundry lags, says CEO Cristiano Amon
Intel’s manufacturing isn’t an option today. That’s the blunt assessment from Qualcomm CEO Cristiano Amon, who says the company will keep building Snapdragon chips with TSMC and Samsung until Intel’s foundry services prove truly competitive. It’s a clear signal to the market: Qualcomm will stay with partners delivering top-tier efficiency, performance, and yields—critical factors for cutting-edge mobile and PC silicon.
Current Snapdragon X laptop processors are produced on TSMC’s N4 process, and these Arm-based machines have been turning heads with impressive efficiency and performance, often outpacing comparable x86 systems. With that momentum, Qualcomm has little incentive to switch fabrication partners unless Intel can match or exceed the bar set by TSMC and Samsung.
Intel’s comeback hinges on new process nodes like 18A and a tentative follow-up dubbed 14A. Questions remain around yields and timing, and there’s even uncertainty over whether 14A will advance if external demand for 18A doesn’t materialize. Adding to the intrigue, reports suggest Intel’s own next-gen Nova Lake chips could split production between TSMC’s N2 and Intel 18A, a move that looks like hedging while the company works through its manufacturing roadmap.
Meanwhile, Qualcomm continues to expand beyond smartphones and PCs. The company recently unveiled Snapdragon Ride Pilot for BMW’s new iX3, calling it data-center-class compute tuned for low power draw. Built with battery efficiency in mind, the platform scales from advanced driver assistance to handling most driving tasks—a major step toward wider adoption of high-performance, energy-efficient automotive compute. Qualcomm is targeting approximately $22 billion in combined automotive and IoT revenue by 2029, underscoring the importance of reliable, efficient manufacturing partners.
For Intel Foundry, winning marquee customers like Qualcomm is essential to achieving scale and profitability. To get there, 18A must prove itself in real-world production, with strong yields and clear performance advantages. If Intel can deliver, Amon has left the door open to future collaboration. Until then, the center of gravity for Snapdragon manufacturing remains firmly with TSMC and Samsung.
The takeaway for shoppers and industry watchers is straightforward: expect more high-efficiency Snapdragon X laptops built on mature TSMC nodes, continued competition in process technology, and a fast-growing push into automotive compute. The next chapter will hinge on whether Intel can translate its ambitious roadmap into reliable, high-volume silicon that customers are eager to adopt.
