Intel is making a major push to scale up EMIB, its advanced chip packaging technology, by placing a large equipment order with manufacturers in Taiwan. The goal is straightforward: increase capacity and readiness for the next wave of high-end AI chips, as global demand keeps climbing and packaging becomes one of the biggest bottlenecks in getting cutting-edge processors out the door.
EMIB, short for Embedded Multi-die Interconnect Bridge, is positioned as an alternative to other widely used advanced packaging approaches in the industry. With shortages and tight capacity elsewhere, more international customers are reportedly looking to Intel as another route to secure advanced packaging supply. That shift is a key reason Intel is moving quickly now, locking in equipment to support expanded production.
According to supply chain reporting from Taiwan, Intel has issued sizable purchase orders for advanced packaging and related tools, with expansions planned for facilities in Oregon in the United States and in Vietnam. The equipment orders are expected to benefit several Taiwanese toolmakers across multiple parts of the packaging flow, including tools used for dry processes and specialized ovens used during manufacturing.
One of the biggest reasons this expansion matters is yield. Advanced packaging isn’t just about stacking or linking chiplets together; it has to be repeatable at high volume with minimal defects. EMIB is said to be performing strongly already, with reported yields around 90%, and Intel is targeting roughly 98%—a level that would make the technology far more appealing for premium, high-volume customers that demand consistent results at scale.
Beyond yield, power efficiency is another major factor. AI accelerators and data center chips are pushing enormous power budgets, and packaging choices can directly affect performance per watt, thermals, and signal integrity. Intel has also been promoting EMIB’s potential cost advantages, scalability, and the ability to support more complex package designs—positioning it as a competitive option for companies building next-generation AI hardware.
The report suggests that Intel’s equipment deliveries are scheduled for the second half of 2026, indicating this is a long-term capacity build rather than a short, tactical purchase. At the same time, manufacturing challenges are still being addressed. For example, package warpage—an issue that can impact reliability and assembly—has reportedly drawn additional attention, with efforts underway to reduce it through practical process improvements and partnerships.
Industry interest in EMIB appears to be growing alongside the broader shift toward chiplet-based designs. The technology has been rumored to attract attention from major AI and cloud players for future accelerators, and it has also been discussed as a path to scaling up increasingly large AI chips where traditional packaging capacity is limited.
This EMIB ramp is also part of a larger strategy. Intel’s broader foundry ambitions include next-generation process nodes such as 18A-P and 14A, and advanced packaging is a critical piece of that plan. In modern semiconductor manufacturing, having a leading process is only part of the equation—companies also need the packaging capacity to integrate multiple dies, high-bandwidth memory, and complex interconnects at scale. By investing heavily now, Intel is aiming to ensure EMIB becomes a high-volume, high-yield option as demand for AI chips continues to surge.
