Intel Z990 and Z970 chipset details point to faster LGA 1954 motherboards for Nova Lake CPUs
Intel’s next generation of desktop motherboards is starting to take shape, and the latest details suggest that the upcoming Z990 and Z970 chipsets will bring a major shift toward PCIe 5.0 connectivity, stronger I/O options, and higher platform power limits for future Nova Lake-S desktop processors.
The new chipsets are expected to power Intel’s next-gen LGA 1954 motherboards, with early designs already in development. Although the official launch is still months away, motherboard makers have reportedly been preparing their Z990 and Z970 products ahead of the arrival of Nova Lake desktop CPUs. Early previews shown around Computex 2026 already hinted at a platform built for high-end storage, modern graphics cards, and expanded connectivity.
One of the most interesting changes is the size of the Z990 chipset itself. The Z990 package is expected to measure 25 x 24 mm, or around 600 mm², while the actual die is said to measure 11.15 x 6.5 mm, or about 72.5 mm². By comparison, the current Z890 chipset package measures 28 x 23.5 mm, or 658 mm², with a die size of 11.15 x 8.33 mm, or around 93 mm².
That makes the Z990 package roughly 8.8 percent smaller than Z890, while the die is around 22 percent smaller. At first glance, that may seem surprising, especially since Z990 is expected to offer stronger platform capabilities. The explanation appears to come down to how Intel is rearranging the chipset’s I/O priorities.
Instead of focusing heavily on PCIe 4.0 lanes for M.2 storage, Z990 is being designed with a stronger emphasis on PCIe 5.0. This means high-end motherboards could offer more full-speed PCIe Gen5 M.2 slots and Gen5 expansion options. PCIe 4.0 support will still exist, but Intel’s enthusiast-class chipset appears to be moving more aggressively toward Gen5 as the new standard for premium desktop platforms.
The Z970 chipset is expected to use the same package and die as Z990, but with some features disabled. This should allow Intel and motherboard vendors to offer a more affordable performance-focused option while keeping much of the same platform foundation.
Power consumption is also changing. The Z970 chipset reportedly has a base power rating of 6.4W, while Z990 rises to 7.9W. For reference, the current Z890 chipset is rated at 6W base power. That increase is not dramatic under normal conditions, but the Z990 chipset may reach up to 14W when fully loaded with PCIe 5.0 devices.
That higher figure would apply when the chipset’s Gen5 capabilities are being heavily used, such as with multiple high-speed SSDs and other connected devices. For most desktop users, typical power draw should be lower, especially if the system uses one graphics card and one or two M.2 drives.
Thermals are also being adjusted. Both Z990 and Z970 are said to have a maximum junction temperature of 113°C, compared to 108°C on Z890. This could result in larger chipset heatsinks on some motherboards, particularly enthusiast models. However, current information suggests that active cooling is not expected to be necessary for most designs.
The biggest attraction of Intel’s 900-series chipsets may be their upgraded connectivity. Z990 is expected to feature a DMI Gen5 x4 connection between the CPU and chipset, while Z970 is expected to use DMI Gen5 x2. This move to a newer DMI generation helps maintain strong bandwidth between the processor and platform controller, even as lane configurations change.
For storage, Z890 offered three PCIe 4.0 x4 connections through the chipset. With the new generation, Intel appears to be changing that layout. Z970 is expected to provide one PCIe 4.0 x4 connection, while Z990 shifts toward PCIe 5.0 x4 for higher-speed storage support. This should make Z990 particularly appealing for users planning to build systems around next-generation NVMe SSDs.
USB support is also being refreshed. USB 3.2 Gen 2×2 support remains part of the platform, while legacy USB 2.0 support is reportedly being removed from the 900-series chipsets. Intel is also expected to support an updated wireless connectivity solution through an add-on CRF card.
Based on current details, the Z990 chipset will offer 48 total PCIe lanes, including 12 PCIe 5.0 lanes from the chipset and 12 PCIe 4.0 lanes. It is also expected to support two CPU USB4 or Thunderbolt 4 ports, four DMI Gen5 lanes, eight SATA 3.0 ports, five USB 3.2 20Gbps ports, ten USB 3.2 10Gbps ports, and ten USB 3.2 5Gbps ports. Z990 should also support CPU overclocking, BCLK overclocking, and memory overclocking, making it the flagship option for enthusiasts.
The Z970 chipset is expected to sit below Z990 while still targeting performance users. It reportedly includes 34 total PCIe lanes, no chipset PCIe 5.0 lanes, 14 PCIe 4.0 lanes, one CPU USB4 or Thunderbolt 4 port, two DMI Gen5 lanes, four SATA 3.0 ports, two USB 3.2 20Gbps ports, four USB 3.2 10Gbps ports, and six USB 3.2 5Gbps ports. It is also expected to support CPU and memory overclocking, though not BCLK overclocking.
Other Intel 900-series chipsets are also expected, including W980, Q970, and B960. W980 appears to be aimed at workstation-class systems with ECC memory support, while B960 will likely serve as the more mainstream option with reduced I/O and no CPU overclocking support.
For high-end desktop builders, Z990 looks like the chipset to watch. Its expanded PCIe 5.0 support, stronger storage potential, overclocking features, and expected Thunderbolt 5 readiness could make it the preferred foundation for flagship Nova Lake-S gaming PCs and creator workstations. Some premium motherboards may also feature triple 8-pin power connectors to support the highest-performance Nova Lake desktop processors.
Intel’s 900-series motherboards are currently expected to debut at CES 2027 alongside the introduction of Nova Lake-S desktop CPUs. A broader retail launch is likely to follow a few weeks later. If the latest information holds true, the Z990 and Z970 platforms could mark a major step forward for Intel desktop motherboards, especially for users who want faster SSDs, more modern I/O, and stronger upgrade potential for the next generation of PCs.
