Intel’s next-gen Panther Lake laptop CPUs are starting to take shape, and a fresh leak lays out what looks like the full lineup. Fourteen chips are reportedly on the way, headlined by a Core Ultra 9 part that can boost up to 5.1 GHz. The iGPU lineup also appears to adopt new branding, with references to an Arc B390-class graphics block showing up in benchmark databases.
At Intel’s recent briefing, we got architecture talk but not the details buyers care about: exact SKUs, core counts, and clock speeds. This new spec dump fills many of those gaps, though some naming remains confusing. Most H-class models stick to a 4P + 8E + 4 LP-E configuration with a 65–80 W boost TDP and a Xe3 iGPU, while non-H parts trend to 55 W and scale down efficiency or graphics resources. Notably, there are two minimalist configurations using just two performance cores plus low-power E-cores, folded into the Core Ultra 5 family.
Here’s the leaked stack with reported boost clocks, core layouts, TDP targets, and iGPU execution units:
– Core Ultra X9 388H: 4P + 8E + 4 LP-E, 65–80 W boost TDP, up to 5.1 GHz, 12 EU Xe3 iGPU
– Core Ultra X9 386H: 4P + 8E + 4 LP-E, 65–80 W boost TDP, up to 4.9 GHz, 12 EU Xe3 iGPU
– Core Ultra X7 368H: 4P + 8E + 4 LP-E, 65–80 W boost TDP, up to 5.0 GHz, 12 EU Xe3 iGPU
– Core Ultra X7 366H: 4P + 8E + 4 LP-E, 65–80 W boost TDP, up to 4.8 GHz, 12 EU Xe3 iGPU
– Core Ultra X7 358H: 4P + 8E + 4 LP-E, 65–80 W boost TDP, up to 4.8 GHz, 12 EU Xe3 iGPU
– Core Ultra X7 356H: 4P + 8E + 4 LP-E, 65–80 W boost TDP, up to 4.7 GHz, 12 EU Xe3 iGPU
– Core Ultra 5 338H: 4P + 8E + 4 LP-E, 65–80 W boost TDP, up to 4.7 GHz, 10 EU Xe3 iGPU
– Core Ultra 5 336H: 4P + 8E + 4 LP-E, 65–80 W boost TDP, up to 4.6 GHz, 4 EU Xe3 iGPU
– Core Ultra 7 365: 4P + 0E + 4 LP-E, 55 W boost TDP, up to 4.8 GHz, 4 EU Xe3 iGPU
– Core Ultra 7 355: 4P + 0E + 4 LP-E, 55 W boost TDP, up to 4.7 GHz, 4 EU Xe3 iGPU
– Core Ultra 5 335: 4P + 0E + 4 LP-E, 55 W boost TDP, up to 4.6 GHz, 4 EU Xe3 iGPU
– Core Ultra 5 325: 4P + 0E + 4 LP-E, 55 W boost TDP, up to 4.5 GHz, 4 EU Xe3 iGPU
– Core Ultra 5 332: 2P + 0E + 4 LP-E, 55 W boost TDP, up to 4.4 GHz, 2 EU Xe3 iGPU
– Core Ultra 5 322: 2P + 0E + 4 LP-E, 55 W boost TDP, up to 4.3 GHz, 2 EU Xe3 iGPU
Key takeaways for laptop shoppers and OEMs:
– Fourteen models span performance tiers from Core Ultra X9 down to streamlined Ultra 5 variants.
– The top-tier H-series aims for strong burst performance with up to 5.1 GHz boost and 65–80 W boost TDPs.
– Xe3 iGPU configurations vary widely, from 12 EUs on higher-end H chips to just 2 EUs on entry 2P designs, suggesting big differences in integrated graphics capability.
– No U-series parts appear in this leak; it focuses on H and non-H models.
– Naming is still messy, blending “Core Ultra X” and “Core Ultra” labels across H and non-H segments.
As always with pre-release specs, treat this as guidance, not gospel. Intel is expected to showcase Panther Lake in full at CES 2026, where final names, clocks, and GPU details should be locked down. For now, the leaked sheet hints at a balanced strategy: higher clocks for premium H designs, leaner non-H parts for thin-and-light systems, and a new Arc B390-branded iGPU family to power everyday visuals and light gaming.
