Intel’s Direct Connect 2025 event recently laid out an exciting roadmap as the company aims to revitalize its semiconductor foundry operations under the leadership of its new CEO, Lip-Bu Tan. Highlighting a fresh approach, Intel is already making strides with its 14A process, a groundbreaking development expected to make waves by the second half of 2026.
During the event, Intel showcased their latest initiative featuring advancements like the PowerVia 2.0 technology. This innovative system, branded as PowerDirect, enhances energy efficiency by delivering power more effectively through specialized contacts directly to transistors. The result? A significant leap that positions Intel two generations ahead of major competitors in the race for efficient backside power delivery.
Complementing the 14A process, Intel’s announcement of new 18A derivatives—namely the 18A-P and 18A-PT—marks another pivotal step. These processes are designed with performance in mind, offering noteworthy improvements over previous nodes. Notably, the 18A-PT is set to stand out as Intel’s first node to incorporate Foveros Direct 3D hybrid bonding, a cutting-edge technology poised to rival leading interconnect solutions in the industry.
As Intel gears up to implement these advanced technologies, the company is already engaging with partners, sharing early versions of their Process Design Kit. Initial feedback from customers suggests enthusiasm and optimism about Intel’s forthcoming offerings.
With these developments, Intel seems primed to take a commanding position in future market landscapes, setting the stage for robust competition and innovation. Keep an eye on this evolving story as Intel continues to reshape the foundry industry with its ambitious plans.
