Intel Joins India’s Semiconductor Push With Advanced Packaging Project in Odisha
India’s semiconductor ambitions have taken another major step forward with a new memorandum of understanding involving Intel and US-based 3DGS. The agreement focuses on setting up an advanced packaging glass-core substrate manufacturing facility in Odisha, strengthening the country’s position in the global chip supply chain.
The proposed facility marks Intel’s first major move into India’s semiconductor ecosystem, signaling growing international confidence in the country’s electronics manufacturing future. While India has already been working to attract chip design, fabrication, and assembly investments, this project highlights a particularly important area of the industry: advanced semiconductor packaging.
Advanced packaging plays a crucial role in modern chip performance. As devices become faster, smaller, and more power-efficient, chipmakers need better ways to connect and integrate components. Glass-core substrates are emerging as a promising technology because they can support higher performance, improved signal efficiency, and better thermal characteristics compared with traditional materials.
For India, the Odisha project could become an important building block in creating a more complete semiconductor manufacturing ecosystem. Instead of focusing only on chip fabrication, the country is also looking at packaging, testing, materials, and component production. This broader approach may help India reduce dependence on overseas supply chains while attracting global technology companies.
Odisha’s selection is also significant. The eastern state has been working to position itself as a destination for high-tech manufacturing and industrial investment. A semiconductor packaging facility could bring skilled jobs, technology transfer, and new opportunities for local suppliers, while also encouraging more electronics companies to explore the region.
The involvement of Intel adds weight to the initiative. As one of the world’s most recognized semiconductor companies, Intel’s participation could help boost India’s credibility as a serious player in chip manufacturing and advanced electronics infrastructure. The partnership with 3DGS also points to the increasing importance of specialized materials and next-generation packaging technologies in the semiconductor industry.
Although the project is still at the MoU stage, it reflects the momentum behind India’s semiconductor mission. The government has been pushing to build a domestic chip ecosystem through incentives, infrastructure support, and partnerships with global firms. If successfully developed, the Odisha facility could support India’s goal of becoming a stronger hub for semiconductor manufacturing, advanced packaging, and electronics production.
This development comes at a time when global demand for chips continues to rise across smartphones, artificial intelligence, data centers, electric vehicles, consumer electronics, and industrial systems. Countries around the world are racing to secure reliable semiconductor supply chains, and India is working to claim a larger role in that future.
The planned advanced packaging glass-core substrate facility in Odisha may not only deepen Intel’s engagement with India but also help the country move closer to building a competitive, end-to-end semiconductor ecosystem.
