Honor is gearing up for its next flagship foldable, the Honor Magic V6, and a fresh leak is already painting a clear picture of what fans can expect from the Magic V5 successor. Shared on Weibo by a well-known tipster, the leak includes “About device” screenshots that reveal two distinct versions of the upcoming foldable along with several key specs.
According to the information shown, the Honor Magic V6 will arrive in at least two models: PNM-AN10 and PNM-AN20. The big difference between them appears to be satellite connectivity, with the PNM-AN20 variant supporting Beidou satellite features. That version also reportedly packs a larger battery, suggesting Honor may be targeting heavier-duty users with the satellite model.
Battery capacity is one of the standout details in the leak. The standard Magic V6 (PNM-AN10) is listed with a 6,850mAh battery, while the Beidou satellite version (PNM-AN20) jumps to 7,150mAh. If accurate, those are eye-catching numbers for a foldable smartphone and could translate into better real-world endurance—one of the biggest pain points for power users considering foldables.
The leak also points to different memory and storage combinations between the two. The standard model is shown with 16GB of RAM and 512GB of storage, while the satellite variant is listed with 12GB of RAM and 256GB of storage. As with most flagship launches, more configurations are expected, but these early listings suggest Honor may differentiate the two versions beyond just satellite support.
Display specs are also included in the screenshots. The inner foldable screen is reportedly set at 2352 × 2172 pixels, and the outer cover display is listed at 2420 × 1080 pixels. While refresh rate and panel type aren’t mentioned here, the resolutions suggest Honor is keeping sharp visuals front and center—especially on the main inner display where productivity, multitasking, and media typically shine.
On the performance side, the Honor Magic V6 is rumored to run Qualcomm’s newest flagship chipset, the Snapdragon 8 Elite Gen 5. That should place it firmly in top-tier territory for speed, gaming performance, on-device AI features, and efficiency—key areas where foldables need to feel as smooth as traditional premium phones.
Interestingly, the leak also claims Honor will include in-house custom chips alongside the main Snapdragon processor. Two names are mentioned: the Honor C1+ and the Honor E2. The C1+ is described as an RF enhancement chip intended to improve wireless connectivity, while the E2 is positioned as a power-enhancement chip, potentially helping with efficiency and battery management. If these chips play a meaningful role, the Magic V6 could deliver improvements in signal stability and power consumption—two areas that can dramatically affect everyday experience.
Software details also appear in the leak, suggesting the Magic V6 will run MagicOS 10 based on Android 16. That combination could bring updated privacy features, smoother multitasking, and foldable-focused optimizations, especially if Honor adds refinements for split-screen use and app continuity between the cover and inner displays.
More official details should surface as launch nears, with global availability expected around March 1. If the leaked specs hold up, the Honor Magic V6 is shaping up to be a serious next-gen foldable contender, combining big batteries, flagship performance, high-resolution displays, and hardware extras designed to improve connectivity and efficiency.
