Hanmi Semiconductor’s chairman, Kwak Dong-Shin, has expressed skepticism about the use of hybrid bonder equipment in the production of next-generation high-bandwidth memory (HBM). This approach, according to him, is both impractical and costly. The South Korean company aims to maintain its leadership in the market despite increasing competition.
By dismissing hybrid bonders, Hanmi Semiconductor signals a strategic focus on more feasible and cost-effective methods for advancing HBM technology. As competitors explore various technological avenues, the company’s stance highlights its commitment to efficient production processes, ensuring they remain at the forefront of the industry.
