A close-up of a processor surrounded by 'Samsung HBM' memory modules.

AMD’s Next-Gen HBM Deal Could Supercharge Samsung’s Taylor 2 Foundry Ambitions

Samsung Foundry Gains Momentum as AMD Reportedly Secures Capacity at Taylor Fab 2 for Advanced HBM Production

Samsung’s chip manufacturing business may be heading toward a major turnaround, thanks to a reported partnership with AMD tied to next-generation High-Bandwidth Memory technology. According to a new report from a Korean business publication, AMD has reserved nearly all of the planned production capacity at Samsung’s second Taylor, Texas fabrication plant, known as Taylor Fab 2.

The deal could be a significant win for Samsung Foundry as it works to strengthen its position in advanced semiconductor manufacturing. While Samsung has long been a dominant force in memory chips, its contract chipmaking division has faced stiff competition in leading-edge logic production. A large-scale AMD commitment would give Samsung a much-needed boost as it prepares to ramp up its 2nm manufacturing process.

Under the reported arrangement, Samsung will produce the logic base dies used in advanced HBM packages at its Taylor Fab 2 facility in Texas. These base dies would then be combined with DRAM made at Samsung’s memory facilities in South Korea, creating complete HBM solutions for AMD.

HBM, or High-Bandwidth Memory, has become one of the most important technologies in the AI and high-performance computing market. It is widely used in AI accelerators, data center GPUs, and advanced processors that require massive memory bandwidth. As demand for AI hardware continues to grow, companies like AMD are looking to secure stable supply chains for critical components.

The reported scale of AMD’s commitment is notable. Taylor Fab 2 is said to cover around 2.7 million square feet, making it roughly 1.5 times larger than Samsung’s first Taylor fab. Sources claim AMD has taken up almost the entire allocated production capacity of the upcoming facility, leaving little room for other early customers.

Construction progress also appears to be moving forward. Ground preparation for the second Taylor facility has reportedly been completed, with major structural work expected to begin soon. Samsung is aiming to start moving equipment into the plant by February 2029, with commercial mass production planned for 2030. The facility is expected to use Samsung’s advanced 2nm process technology.

This development follows Samsung’s earlier success in securing automotive chip production tied to its first Taylor site. With AMD now reportedly stepping in for Taylor Fab 2, Samsung appears to be building a stronger customer base for its U.S. foundry operations.

However, one major name remains absent from Samsung’s foundry customer list for advanced HBM base dies: NVIDIA.

Previous reports have suggested that NVIDIA is pushing its memory suppliers to standardize custom HBM base die production through a single foundry partner. The goal would be to simplify memory controller design, reduce latency differences, improve thermal consistency, and avoid performance variations that can happen when using multiple chip manufacturers.

For NVIDIA, using one standardized production route could also reduce validation complexity. Instead of qualifying different base die designs from multiple memory partners and foundries, the company could streamline development and speed up deployment of its custom memory technologies.

That strategy may make it harder for Samsung to win NVIDIA’s HBM base die business in the near term. Still, Samsung does not appear to be standing still. The company is reportedly testing and validating its own foundry processes for advanced HBM base dies, aiming to prove that it can compete in one of the fastest-growing areas of semiconductor manufacturing.

The AMD partnership could also help Samsung use its 2nm resources more effectively. By focusing part of its advanced foundry roadmap on HBM base die production, Samsung may free up room to pursue other strategic projects, including future Exynos 5G modem development and additional collaborations with AMD.

For Samsung, this reported deal represents more than a single customer win. It could mark an important step toward restoring confidence in its foundry business, expanding its U.S. manufacturing footprint, and competing more aggressively in the AI chip supply chain.

If the report proves accurate, AMD’s involvement would give Samsung Foundry a strong foundation for Taylor Fab 2 before the facility even begins production. While landing NVIDIA would still be a major prize, Samsung may have already found a valuable path forward in the booming market for advanced HBM and AI-focused semiconductor packaging.