AMD Versal Premium Gen 2 Brings LPDDR5X Memory on Package for Compact AI, Networking, and Embedded Systems
AMD has introduced its first system-on-chip family with integrated on-package memory, marking a major shift in how high-performance adaptive SoCs can be designed for space-constrained and bandwidth-hungry applications. The new AMD Versal Premium Gen 2 Memory on Package, also known as MoP, combines the company’s adaptive SoC technology with up to 32 GB of LPDDR5X memory built directly into the package.
The result is a more compact, more efficient platform aimed at AI inference, video processing, network security, telecom infrastructure, enterprise systems, and mission-critical embedded deployments. Compared with the previous Versal generation, AMD says the new design can deliver up to a 10x compute uplift, while also reducing board area by more than 60% versus systems using discrete LPDDR5X memory.
One of the biggest changes is AMD’s decision to use LPDDR5X on-package memory instead of relying on external DRAM or high-bandwidth memory. With memory pricing and supply becoming increasingly important factors for system designers, AMD’s approach gives engineers a way to achieve high bandwidth while avoiding the complexity, space requirements, and lifecycle concerns of external memory layouts.
The Versal Premium Gen 2 MoP devices can integrate up to four LPDDR5X memory ICs directly on the package, offering up to 32 GB of total capacity. With memory speeds reaching up to 9,000 MT/s, the platform can provide as much as 288 GB/s of bandwidth. That level of throughput is designed to keep demanding workloads moving quickly, especially in applications where data must be processed in real time.
For engineers, the key advantage is not only performance but also simplicity. Traditional board-level memory designs require careful routing, signal integrity validation, simulations, and testing. By moving LPDDR5X onto the package, AMD is offering a pre-validated memory interface that can help reduce design risk, shorten development time, and lower the chance of expensive board redesigns.
This is especially important for compact systems where every millimeter of board space matters. AMD says the MoP architecture can reduce board area by over 60% compared with discrete LPDDR5X designs. That opens the door for smaller PCIe, PXI, and VPX deployments, as well as systems built around tight thermal and physical constraints.
The new Versal Premium Gen 2 MoP family is also positioned for advanced enterprise and data center connectivity. The devices include support for PCIe 6.0 at 64 Gb/s and CXL 3.1 through hardened IP blocks. When paired with AMD EPYC processors, these capabilities can help accelerate data movement in high-performance computing, AI, storage, and networking environments.
CXL support is particularly important for future-looking systems because it enables memory pooling and memory expansion architectures. By combining on-package LPDDR5X with access to CXL-based memory resources, system architects can build platforms that balance local high-speed memory with scalable external memory capacity.
AMD is targeting a wide range of demanding deployments with this new SoC family. Potential use cases include enterprise AI acceleration, secure networking equipment, telecom infrastructure, video analytics, edge computing, test and measurement systems, and aerospace or defense platforms using compact VPX designs. The ability to place high-bandwidth memory directly on the chip package could make the technology especially attractive for systems where external DRAM is difficult to implement or maintain over long product cycles.
Long-term availability is another major part of AMD’s pitch. The Versal Premium Gen 2 MoP devices are designed for 15-plus-year lifecycle support, making them suitable for industries that cannot easily redesign hardware every few years. This is a significant benefit for industrial, telecom, aerospace, defense, and infrastructure applications where hardware platforms often remain in service for a decade or longer.
The devices are also built for harsh environments, with support for industrial-grade operation from -40 degrees Celsius to 110 degrees Celsius. That wide temperature range makes the platform suitable for always-on systems operating in challenging physical conditions, including outdoor infrastructure, rugged embedded hardware, and mission-critical equipment.
Security is another focus of the Versal Premium Gen 2 MoP platform. The SoCs include PCIe Integrity and Data Encryption, a feature associated with PCIe 6.0 that helps protect data in transit at the link layer. Integrated DDR memory encryption helps secure data at rest without consuming programmable logic resources, while hard 400G high-speed crypto engines are designed to support secure processing at very high bandwidth.
AMD has also detailed several models in the Versal Premium Gen 2 MoP lineup. The VP3422 features around 2.56 million system logic cells, approximately 1.17 million CLB LUTs, 256 Mb of total RAM, 32 GB of integrated LPDDR5X through eight 32-bit controllers, 6,080 DSP engines, two PCIe Gen6 x8 interfaces with DMA and CXL 3.1, and 56 GTM transceivers.
The VP3522 increases the logic resources to roughly 3.27 million system logic cells and around 1.49 million CLB LUTs, with 327 Mb of total RAM. It also includes 32 GB of LPDDR5X through eight 32-bit controllers, 2,512 DSP engines, two PCIe Gen6 x8 interfaces with DMA and CXL 3.1, and 72 GTM transceivers.
The VP3622 shares the same general logic and memory capacity as the VP3522 but raises DSP resources significantly, offering 7,616 DSP engines. Like the other models, it supports 32 GB of integrated LPDDR5X, PCIe Gen6 x8 connectivity, CXL 3.1, and high-speed transceiver support.
By bringing memory onto the package, AMD is trying to solve several challenges at once: bandwidth demand, board complexity, space limitations, memory availability, security, and long-term product support. This makes Versal Premium Gen 2 MoP more than just a faster adaptive SoC. It is a platform designed for engineers who need predictable performance, compact layouts, and a stable supply path for long-life systems.
AMD expects Versal Premium Gen 2 MoP devices to begin sampling toward the end of 2026, with production shipments planned for the second half of the following year. If the platform delivers as promised, it could become an important option for next-generation AI, networking, embedded, and industrial computing designs where high bandwidth and compact size are both essential.
