The revelation of AMD’s Zen 5 architecture, powering the Ryzen 9000 “Granite Ridge” CPUs, has taken a fascinating turn with the emergence of high-resolution die shots from Fritzchens Fritz. These images provide a closer look at the innovations within AMD’s latest architecture and tease what’s on the horizon.
The processor dissected in these high-res shots is the Ryzen 5 9600X, showcasing the Zen 5’s core complex die (CCD) and integrated on-die (IOD) in stunning detail. This detailed examination highlights the architectural shifts and possible advancements packed into AMD’s upcoming lineup.
Each Zen 5 CCD, codenamed Eldora, is built with a die size of 70.6mm², housing 8.315 billion transistors and fabricated on TSMC’s N4P process node. These images confirm that while the Zen 5 CCD has undergone significant changes, the IOD still utilizes the TSMC 6nm process, maintaining continuity from the Zen 4 series.
One standout detail of the Zen 5 CCD is the reduced usage of Through Silicon Vias (TSVs) compared to the previous Zen 4 and Zen 3 models. This revelation could point to AMD opting for a new 2-Hi stacked 3D V-Cache design, potentially allowing for higher cache amounts in future releases. However, for models like the AMD Ryzen 7 9800X3D, there might not be a drastic increase in cache compared to predecessors, considering cost and complexity factors for mainstream adoption.
Looking ahead, AMD plans to incorporate the Zen 5 architecture across a diverse array of future lineups, including Strix, Strix Halo, and Turin variants, among others. This marks just the beginning of the Zen 5 rollout, promising exciting developments and offerings that will cater to both high-performance needs and mainstream popularity. Stay tuned for more advancements from AMD as they continue to unveil the potential of Zen 5.
