The Luckfox Lyra Pi is a fresh addition to the world of single-board computers, now designed with cellular connectivity to cater to projects situated far from Wi-Fi networks. Expanding on the famed Raspberry Pi’s legacy, the Lyra Pi offers versatility through its range of models and LTE modem compatibility, making it an attractive choice for hobbyists and developers alike.
This innovative board introduces four model variants, equipped with the SIM7600G-H-M.2 LTE Cat 4 module, supporting LTE-TDD, LTE-FDD, HSPA+, GSM, GPRS, and EDGE standards. It’s designed for seamless installation, enhancing functionality through cellular connectivity. Each variant incorporates three Cortex-A7 processing cores, reaching speeds up to 1.2 GHz, alongside a Cortex-M0 processing core.
For storage, the Lyra Pi A comes with 8 GB of eMMC, while the Pi B variant relies on a memory card. Notably, the Pi A models lack a memory card slot, differentiating storage options across the lineup. Additionally, both the Lyra Pi A W and the Pi B W models include Wi-Fi 6 and Bluetooth 5.2 modules, which can be added for a modest additional cost.
All models boast 512 MB of DDR3L RAM, and while HDMI connectivity for screens isn’t available, displays can be connected via MIPI DSI. The board features two USB 2.0 ports, with additional ports accessible via headers, and Ethernet connections capable of speeds up to 100 MBit/s. A SIM card slot sits conveniently beside the M.2 slot for the mobile modem, complemented by a combined audio jack. A unique color-coded GPIO pin header allows for easy integration of sensors and actuators through UART.
Priced at $67, the board includes the 4G module kit and 8 GB of eMMC storage, excluding the optional Wi-Fi/Bluetooth module, which is an additional $3. The compact board dimensions of 85 x 56 millimeters make it a functional yet space-efficient solution, ideal for various tech projects.
The Lyra Pi represents a leap forward in single-board computer technology, blending connectivity and capability to support the ever-expanding array of tech innovation.
