TSMC’s 1.4nm chip plans move forward as key land dispute is resolved
TSMC’s road to 1.4nm chip production appears to be back on track after a major land acquisition issue was reportedly cleared. Earlier reports suggested that the company’s next-generation semiconductor process was progressing without major technical problems, but the real challenge was not inside the lab. Instead, TSMC had been facing resistance from local landowners over the expansion of the Longtan Science Park in Taiwan.
That obstacle now appears to have been resolved. According to a recent Taiwanese media report, TSMC has secured the land needed for two 1.4nm fabrication plants, along with one panel-level advanced packaging facility. This is an important step for the company as it prepares for the next major leap in chip manufacturing beyond 2nm.
The Phase 3 expansion of Longtan Science Park had previously run into strong opposition from residents, causing TSMC to halt the project in October 2023. Much of the land required for the expansion was privately owned by local residents, with reports indicating that around 88 percent of the needed area belonged to the local population.
The situation has now changed, with landowners reportedly becoming more open to the project after seeing the economic benefits generated by other semiconductor production sites. Without TSMC’s investment, the land was expected to remain primarily used for tea cultivation. With the agreement now moving forward, the expansion zone has reportedly been restored from a reduced 89.63 hectares back to 104.19 hectares.
This development is significant because TSMC’s 1.4nm process is expected to become one of the company’s most advanced and expensive manufacturing projects to date. Pilot production for the 1.4nm node is reportedly planned for the second half of 2027, giving the company time to prepare facilities, equipment, and supply chain support before full-scale production begins.
At the same time, TSMC continues to push forward with its 2nm technology. The company is reportedly aiming to reach a major production milestone of 100,000 wafers per month by the end of 2026. That would place TSMC in a strong position as demand grows for more powerful and energy-efficient processors used in smartphones, data centers, artificial intelligence systems, and high-performance computing products.
The 1.4nm process is expected to be even more ambitious. Previous estimates suggested that TSMC could invest around $49 billion in four plants dedicated to sub-2nm wafer production. Such an investment would underline how important advanced chip manufacturing has become as global technology companies compete for faster, smaller, and more efficient processors.
Apple is expected to be one of the major customers for TSMC’s future 1.4nm production. The company could reportedly use the technology for its A22 Pro chip, expected to power a future iPhone lineup in 2028. If that timeline holds, the move to 1.4nm could deliver major improvements in performance, battery efficiency, and thermal management for next-generation mobile devices.
With the land issue now largely out of the way, TSMC can focus on executing its roadmap. The company’s progress in 2nm and 1.4nm chip manufacturing will be closely watched, as these technologies are likely to shape the future of smartphones, AI hardware, advanced computing, and the broader semiconductor industry.
