Google has officially cleared up the biggest rumor surrounding the Tensor G6: the new chip inside the Pixel 11 series is not built on a 2nm process. Instead, the company confirmed that Tensor G6 uses TSMC’s N3P manufacturing technology, a refined 3nm node designed to improve efficiency and performance over earlier 3nm designs.
The confirmation came during the Pixel launch event in Taiwan, where Google hardware executive Peng Yu-chun shared details about the chip’s production. His comments put an end to weeks of speculation that Google might leap ahead of competitors by launching the first smartphone processor based on TSMC’s 2nm process.
That rumor gained attention because a 2nm Tensor G6 would have been a major milestone for the Pixel 11 lineup. It would have positioned Google ahead of the usual fall flagship chip cycle and made the Pixel 11 series one of the most advanced smartphone families on the market from a semiconductor standpoint. However, such a move would also have been expensive, especially since Pixel shipments are smaller compared with the massive volumes ordered by the largest smartphone chipmakers.
By choosing TSMC’s N3P process, Google appears to be taking a more practical route. N3P is still an advanced 3nm-class technology and should offer meaningful gains in power efficiency, thermal behavior, and overall chip performance. For Pixel users, that could translate into smoother AI features, better battery life, improved camera processing, and more consistent performance during demanding tasks.
The Tensor G6 is expected to play a central role across all four Pixel 11 models. Google’s Tensor chips have never been only about raw benchmark numbers. Instead, the company has focused heavily on AI-driven features, computational photography, voice recognition, on-device intelligence, and deep software-hardware integration. With Tensor G6, Google is likely continuing that strategy while relying on TSMC’s refined 3nm process to make the experience more efficient.
Peng Yu-chun also addressed another major issue facing the tech industry: rising DRAM prices. He explained that memory price increases are affecting the broader sector, influencing both costs and supply conditions. Rather than simply passing all of those increases directly to consumers, Google is working on ways to reduce the impact through software and system-level improvements.
According to Peng, Google is optimizing its user interface, improving memory usage efficiency, and refining the overall hardware and software architecture across its product teams. This suggests the company is looking for smarter ways to manage memory demands, especially as smartphones become more dependent on AI features and advanced multitasking.
The Pixel launch event in Taipei also highlighted a major milestone for Google’s hardware presence in Taiwan. The company marked 20 years of hardware engineering operations in the region. Google describes its Taiwan facility as its largest hardware and AI infrastructure research and development center outside the United States.
That Taiwan team played a direct role in developing Tensor G6 in collaboration with TSMC. This partnership is becoming increasingly important as Google continues to invest in custom silicon for Pixel phones and AI-powered devices.
The takeaway is simple: the Tensor G6 is not the rumored 2nm breakthrough chip, but it is still built on a modern and capable 3nm-class process. With TSMC’s N3P technology, closer chip collaboration, and Google’s focus on AI optimization, the Pixel 11 series may still deliver meaningful real-world improvements where they matter most: battery life, camera performance, AI features, and daily responsiveness.
