Google’s Pixel 9 series, featuring the revamped Tensor G4 chipset, has been in the market for a bit, but fresh performance leaks suggest that it still significantly lags behind its competitors. A recent 3DMark Wild Life Extreme test puts the Pixel 9 Pro to the test, revealing that while the Tensor G4 shows slight speed improvements over the Tensor G3, it still can’t keep up with the older Snapdragon 8 Gen 1. However, it’s not all gloom and doom. The new SoC boasts much better power efficiency, which offers a silver lining.
The Snapdragon 8 Gen 1 consumes 48.2 percent more power than the Tensor G4, indicating that Samsung’s refined 4nm process made a substantial difference. A well-known smartphone reviewer, Golden Reviewer, released a performance chart showing the results of various smartphone and tablet chipsets subjected to the 3DMark Wild Life Extreme test. The Tensor G4 clocked in at a score of 2,618, only marginally better than the Tensor G3’s 2,445. This benchmark involves tests that push both the CPU and GPU to their limits, suggesting that the improved CPU cluster in the Tensor G4 could be behind the modest performance bump.
The GPU in the Tensor G4 hasn’t seen any changes from the Tensor G3, which is perhaps why performance gains are minimal. While it’s disappointing to note that Google’s latest silicon is slower than the Snapdragon 8 Gen 1, a chipset from 2021, there is another side to this story: power efficiency. The Tensor G4 triumphs over both the Tensor G3 and Snapdragon 8 Gen 1 in terms of power efficiency, all thanks to Samsung’s upgraded 4nm process.
In fact, the Tensor G4 outshines even the Snapdragon 8+ Gen 1 in efficiency metrics. However, it’s essential to recognize the performance gap between these two. A Google executive has mentioned that the new SoC wasn’t engineered to win benchmarking wars but is designed with specific user tasks in mind. This statement aims to shift the focus from synthetic benchmarks to real-world performance benefits that users would experience.
Looking forward to 2025, the anticipation builds for the Tensor G5, which is expected to be mass-produced on TSMC’s second-generation 3nm process. The Tensor G5 will also utilize InFO-POP packaging, known for reducing die size and enhancing power efficiency. This upcoming chipset could potentially address the performance shortfalls seen in the Tensor G4 and take Google’s silicon to the next level.
Stay tuned to see how Google’s chipsets evolve and what they mean for the future of smartphone performance and efficiency.
