The Kirin 9000S, crafted by SMIC utilizing a 7nm process, has stirred the semiconductor world. This development underscores China’s ambition to close the technological gap with the U.S., leveling the playing field in the process. While it was reported last year that SMIC had made strides with a 5nm node, Huawei surprising retained its flagship chip on the older 7nm technology. That may change soon if recent tips are accurate, suggesting that SMIC’s 5nm yields sit comfortably between 60-70 percent. However, some remain skeptical about these claims.
Rumors suggest that SMIC’s 5nm yields are comparable to Samsung’s 3nm GAA process, as reported by Weibo tipster Fixed Focus Digital. This could signal a transformative step in China’s wafer production capabilities. Despite this optimistic outlook, skepticism remains, with some dismissing these figures outright.
For instance, a source known as @Jukanlosreve, conversing with an insider from China, expressed doubts about these rumors. According to previous updates, SMIC’s 5nm chip development may wrap up by 2025, but expected costs could inflate by 50 percent due to using older DUV equipment instead of the advanced EUV machinery essential for efficient semiconductor production at this level.
Considering SMIC’s timeline, doubts are understandable. Huawei’s X90, operating with SMIC’s 7nm technology, reflects this reality. Although a 70 percent yield is viable for mass production, cautious optimism is advised regarding Fixed Focus Digital’s assertions, as SMIC has yet to validate these advancements with tangible results.
Encouragingly, China is reportedly testing homegrown EUV machines, poised for trial production by the third quarter of 2025. SiCarrier, closely linked with Huawei, has secured $2.8 billion in funding, positioning itself to rival ASML with locally manufactured EUV technology. Should SMIC face challenges producing its own 5nm processes, it could potentially leverage third-party advancements for future innovation, pending success from these emerging players.
