SJ Semiconductor Begins $1.47 Billion 3DIC Manufacturing Project in Shanghai
SJ Semiconductor has officially started construction on a major 3DIC manufacturing project in Shanghai’s Lingang New Area, marking a significant step forward for China’s advanced semiconductor packaging industry.
The project carries an investment of CNY 10 billion, or approximately US$1.47 billion, and is designed to expand production capacity for next-generation chip packaging technologies. Once completed, the facility is expected to support growing demand from high-performance computing, artificial intelligence, and data center applications.
3DIC, or three-dimensional integrated circuit packaging, is becoming increasingly important as chipmakers look for ways to improve performance, reduce power consumption, and fit more computing power into smaller designs. Instead of relying only on traditional chip scaling, advanced packaging allows multiple chip components to be stacked or closely integrated, helping improve bandwidth and efficiency.
The new Shanghai facility is expected to strengthen SJ Semiconductor’s role in the advanced packaging supply chain. As AI servers, cloud computing systems, and high-performance processors require faster and more efficient chips, demand for sophisticated packaging solutions continues to rise.
Shanghai’s Lingang New Area has become a key hub for semiconductor development, attracting investment in chip manufacturing, equipment, materials, and packaging. SJ Semiconductor’s latest project adds momentum to the region’s ambition to build a stronger and more complete semiconductor ecosystem.
The investment also reflects the broader industry shift toward advanced packaging as a critical part of chip innovation. With demand for AI chips and data center hardware accelerating worldwide, companies capable of delivering high-density, high-performance packaging are becoming increasingly important to the future of computing.
SJ Semiconductor’s CNY 10 billion project is expected to enhance local manufacturing capabilities, support industrial growth in Shanghai, and help meet the rising need for advanced chip packaging used in AI, high-performance computing, and large-scale data infrastructure.
