Turemetal’s compact UP3 case is making waves with its remarkable heat dissipation capabilities. Inside, Intel’s Arrow Lake mid-range processors efficiently maintain temperatures below 80°C, even in a fanless mini-ITX setup. Typical daily operations keep it cooler, under 60°C.
Intel’s latest desktop processors may have faced challenges with previous models, but Arrow Lake shows promise in power efficiency. The Core Ultra 7 265K is an exemplary choice for a fanless mini PC, as demonstrated by a custom builder on the ChipHell forum. Despite not being a low TDP model—starting at 125 W and peaking at 250 W—it boasts 8 performance cores, 12 efficiency cores, a total of 20 threads running up to 5.5 GHz, and integrates an NPU with an Arc GPU featuring 4 Xe cores. Designed for an audiophile seeking a quiet environment, this setup excludes a dedicated GPU.
Turemetal, known for its innovation in the fanless community, offers the UP3 case measuring 300 x 300 x 200 mm. It utilizes six 8 mm heatpipes connecting the CPU passive block to the radiators on either side, maintaining CPU temperatures between 46-60°C during moderate use, and can reach up to 80°C under full load—still within safe limits. However, the Samsung 990 Evo Plus 1 TB NVMe SSD needs an additional heatsink as it hits 92°C during intense operations.
The build also features an Asus ROG STRIX B860-I GAMING WIFI motherboard, 16 GB of DDR5-4800 RAM, and an Intel S35101 6 TB SATA SSD for ample music storage, ensuring future upgrade potential.
