TSMC currently stands unrivaled as it gears up to enhance its 2nm technology production later this year. However, with patience and persistence, Samsung could potentially challenge this dominance with its own 2nm GAA (Gate-All-Around) technology. Although the journey is challenging, reports indicate that Samsung is steadily advancing in its next-generation lithography, with expectations of significant demand for these chips for the next four years.
Samsung is taking a more measured approach as it works through challenges in improving 2nm GAA yields. The company is in a good position, having chosen to focus on perfecting its 2nm process by delaying its 1.4nm technology. This strategic decision allows for the introduction of multiple variations of the cutting-edge process. Internally, Samsung believes demand for 2nm GAA wafers will remain robust for at least three years, during which it aims to address issues like heat dissipation and performance stability.
The company’s recent strategy, dubbed ‘selection and concentration,’ centers on focusing solely on the 2nm GAA process with a target yield of 70 percent. Though these numbers lag 20-30 percent behind TSMC’s, they surpass Samsung’s initial conservative forecasts. With mass production slated for the latter half of 2025, Samsung is busy setting up manufacturing lines at its Pyeongtaek plant and other locations. Future plans include evolving the 2nm GAA node with a second-generation process already in the design stage.
Moving further, the third-generation process, known as ‘SF2P+,’ is expected within two years, although it remains unclear where production will take place. Given Samsung’s previous struggles, building trust with industry partners is crucial. Offering 2nm GAA wafers at competitive prices may help attract customers. In due time, Samsung could become a strong competitor in this space, but for now, TSMC remains the leader without equal.
