Google is gearing up to unveil its flagship Pixel 10 series later this year. A notable shift is on the horizon, as the company’s Tensor G5 chipset will be mass-produced by TSMC instead of Samsung. This decision takes advantage of TSMC’s second-generation 3nm ‘N3E’ node and InFO-POP packaging. The change has left Samsung puzzled, primarily as its own setbacks seem to have influenced Google’s decision.
While Samsung has made strides with its 2nm GAA technology, TSMC’s consistent success in producing wafers with a higher yield made Google’s choice clear. According to reports, Samsung’s Device Solutions division is now deeply analyzing this development, aiming to boost its foundry capabilities after losing Google.
Google executives recently secured an exclusive deal with TSMC to produce Tensor chipsets up until the Pixel 14, marking a commitment that spans five years. Although Samsung has struggled to improve yields on its 3nm GAA node, it has seen some progress with the 2nm technology. The Exynos 2600 prototype has recently entered mass production, and Samsung is determined to reach a 50% yield target before further enhancements.
Samsung’s efforts aim to reassure former clients of its competitiveness against TSMC. However, companies like Google and Qualcomm are expected to scrutinize Samsung’s chipsets meticulously before considering any new orders, potentially exploring dual-sourcing strategies. Industry insiders note that Samsung’s foundry faces unresolved challenges leading to ongoing discussions and concerns.
Despite Google’s switch to TSMC for the Tensor G5, it remains reliant on Samsung for other components. The Pixel 10 series continues to utilize Exynos 5G modems, delaying any shift to MediaTek solutions. Looking ahead, Samsung might still win back Google’s business if its upcoming technologies prove effective. Only time will reveal how this situation unfolds.
