NVIDIA’s CEO, Jensen Huang, has made it clear that the company remains unwavering in its partnership with TSMC, highlighting that there are no viable alternatives to the Taiwan-based leader, especially in the realm of CoWoS and advanced packaging technologies.
Over the years, NVIDIA and TSMC have built a formidable alliance, particularly strengthened with the rise of AI. Jensen Huang spoke at the GTC Taipei Global Press Conference, expressing NVIDIA’s full reliance on TSMC for their semiconductor needs, indicating that neither Samsung Foundry nor Intel have proven suitable.
Huang emphasized the uniqueness of TSMC’s CoWoS technology, which has allowed NVIDIA to push the boundaries of performance. This technology enables the integration of multiple chips, achieving levels of performance previously unreachable by simply shrinking nodes. It’s a critical factor in NVIDIA’s success, as CoWoS has helped the company transcend Moore’s Law.
While NVIDIA did explore collaborations with Samsung and Intel for advanced packaging, a concrete deal hasn’t materialized. In the semiconductor arena, NVIDIA stands as a major partner for TSMC, surpassing even Apple in terms of order valuations. Furthermore, NVIDIA’s significant role in supporting TSMC’s US expansion underscores the depth of their partnership.
Jensen Huang’s statements at Computex emphasized the enduring strength of the NVIDIA-TSMC collaboration. With TSMC’s expansion into the US, this alliance not only bolsters technological advancements but also offers NVIDIA a buffer against geopolitical challenges.
