Samsung has a long track record of experimenting with advanced chip packaging to squeeze out better performance, improved efficiency, and cooler operating temperatures from its Exynos processors. Instead of relying only on smaller manufacturing nodes, the company has been steadily upgrading how its silicon is physically assembled and cooled inside a phone.
It started with Fan-out Wafer Level Packaging (FOWLP) on the Exynos 2400, a move designed to help with heat management and overall power behavior. Later, Samsung introduced Heat Pass Block (HPB) on its first 2nm GAA (Gate-All-Around) system-on-chip, the Exynos 2600, continuing its push to control thermals as chips get denser and more powerful.
Now, a new report says Samsung is developing another packaging approach called “side by side” (SbS), and it could show up in a future Exynos generation. The key difference is in how the main chip die and memory are arranged. With SbS packaging, the Exynos die would sit horizontally next to the DRAM rather than being stacked in a more traditional layout. Samsung would then place a Heat Pass Block on top of both components.
Why does that matter? Because heat would have a shorter, more direct path out of both the processor and the memory. Putting the die and DRAM side-by-side and covering them with the HPB could allow heat to spread and dissipate faster, which typically leads to lower temperatures under load. Better thermals can translate into more stable performance, less aggressive throttling, and potentially improved sustained gaming and multitasking—exactly the areas where modern flagship smartphones are frequently pushed hardest.
There’s another practical advantage: SbS could help reduce the overall thickness of the chip package. That may not sound exciting at first, but it becomes important for device makers chasing ultra-thin designs. If Samsung ever revives an extra-slim “Edge”-style flagship concept in the future, a thinner chipset package could help free up space for a larger battery, enhanced cooling hardware, or simply a slimmer chassis. The same logic applies to any brand looking to ship thinner smartphones—assuming they’re willing to manufacture on Samsung’s 2nm GAA process and meet the volume requirements that come with cutting-edge production.
As for where SbS might debut, earlier reports suggested Samsung has been testing the Exynos 2600 for a future Galaxy Z Flip model. Even so, it doesn’t sound likely that the clamshell foldable will be the first device to launch with SbS packaging, at least based on what’s currently known. Still, product plans can change, and foldables are exactly the kind of devices where space constraints and heat are constant engineering battles—so the idea remains intriguing.
Looking further ahead, there’s no official confirmation yet about development on an Exynos 2700, but this is one potential candidate to receive the new side-by-side packaging. Another strong possibility is the Exynos 2800, which is rumored to feature a GPU designed entirely in-house by Samsung. If that chipset ends up powering more than just smartphones—such as tablets or other high-performance mobile products—SbS packaging could become even more valuable, since sustained workloads and thermal limits are even more important across larger device categories.
In short, Samsung’s side-by-side packaging concept appears aimed at two big goals smartphone buyers actually feel: cooler performance over long sessions and slimmer device designs without sacrificing capability. If SbS reaches mass production in a future Exynos chipset, it could become a meaningful part of Samsung’s strategy to make its processors more competitive in next-generation flagship and ultra-thin phones.
