MSI is set to release its next-gen MEG X870E GODLIKE flagship motherboard, designed to support AMD Ryzen 9000 CPUs and next-gen Zen processors. This impressive motherboard will feature a robust 28-phase power delivery system, utilizing the X870E and X870 chipsets. Initially showcased at Computex 2024 and subsequently at Gamescom 2024, the MEG X870E GODLIKE stands out with its substantial power and extensive connectivity options.
The motherboard adopts an E-ATX form factor, measuring 288×304.8mm, ensuring compatibility with AMD’s Ryzen 9000, 8000, and 7000 series CPUs. It’s equipped to handle high power demands with 110A power stages supplied through two 8-pin connectors and a standard 24-pin ATX power connector. The board includes four DDR5 DIMM slots, supporting speeds over 8000 MT/s and capacities up to 256GB using the latest 64GB modules. Additional features include DEBUG and EZ DEBUG LEDs, along with power and reset switches.
Key specifications of the MEG X870E GODLIKE motherboard include:
– Support for AMD Ryzen 9000/8000/7000 desktop CPUs (AM5 socket)
– 28-phase VRM design offering 110A for the CPU
– Dual 8-pin power connectors for the CPU
– Four DDR5 DIMM slots supporting up to 256 GB capacities and EXPO DDR5-8000+ memory
– 10-layer and 2 oz copper PCB design
– Eight USB Type-C ports (2x 40Gbps, 1x 20Gbps, 5x 10Gbps)
– Two x16 PCIe Gen 5 slots (x16/x8 electrical configuration)
– Five M.2 slots (2x Gen 5, 3x Gen 4)
– M.2 Shield Frozr heatsinks for M.2 slots
– Steel-reinforced PCIe and memory slots
– Dual X870E PCH dies
– Additional 8-pin connector for PCIe power, supporting RTX 50 GPUs
– Four SATA III ports
For expansion, the motherboard offers two PCIe Gen 5.0 connectors (1×16 and 1×8) and a single PCIe 3.0 x1 slot. Storage is enhanced with five M.2 slots, all equipped with MSI’s M.2 Shield Frozr heatsinks that include magnetic locks and RGB lighting for the top-most slot. PCIe slots and M.2 devices benefit from EZ release technologies, simplifying installation and removal. Additionally, four SATA III ports and two USB3 front panel headers are included.
The rear panel features a total of eight USB Type-C ports, seven positioned on the rear panel and one for the front, with the front panel port supporting up to 60W PD through an additional 8-pin connector. Ports on the rear panel include two 40Gbps, one 20Gbps, and five 10Gbps ports. The rear panel also includes stacked PCB layers for extra USB port support, dual networking ports, and WiFi 7 capability. A dedicated heatsink houses the USB4 controller near the rear IO.
MSI plans to release the MEG X870E GODLIKE following the initial wave of AMD 800-series motherboards. Expected to feature premium CPU overclocking capabilities, this high-end motherboard will come with a corresponding premium price tag. Further details on design, heatsinks, and layout will be available soon.
