Manz Asia Expands Panel-Level Packaging Push as Demand for Advanced Chip Packaging Grows
Manz Asia is strengthening its position in the fast-growing panel-level packaging market as semiconductor manufacturers look for more efficient ways to support next-generation chip production.
According to general manager Robert Lin, the company has delivered more than 50 panel-level electrochemical deposition systems between 2016 and 2026. These systems support a wide range of panel sizes, from 310mm to 700mm, and include equipment designed for both research and development as well as volume production.
Panel-level packaging, often called PLP, is gaining momentum across the semiconductor industry because it offers a potential path to improved manufacturing efficiency and better cost control compared with traditional wafer-level processes. As demand increases for advanced packaging solutions used in artificial intelligence, high-performance computing, automotive electronics, mobile devices, and other data-intensive applications, companies are investing more heavily in scalable production technologies.
Manz Asia’s expanded focus on PLP highlights the industry’s shift toward larger panel formats and more flexible manufacturing platforms. Electrochemical deposition plays an important role in advanced packaging because it is used to form critical metal layers and interconnect structures needed for modern semiconductor devices.
By supplying systems across both development and production environments, Manz Asia is positioning itself to serve chipmakers and packaging companies at different stages of adoption. Its decade-long shipment record suggests growing market acceptance for panel-level electrochemical deposition equipment as the technology moves closer to broader commercial use.
With more semiconductor companies exploring panel-level packaging to improve throughput and reduce production costs, demand for reliable PLP equipment is expected to keep rising. Manz Asia’s continued investment in this area could help the company capture a larger role in the advanced semiconductor packaging supply chain.
