Loongson is gearing up for a major leap in its server roadmap with the 3D7000 CPU family, now in development and targeting a 2027 debut. The new series is designed around a sub-10nm process and, notably, moves to chiplets with 32 or more cores each—doubling the per-chiplet core density of its current generation. If the company follows its usual cadence, broad deployment could realistically slip into 2028.
This direction marks a significant step beyond the existing 3C60000 lineup, which is believed to use a 12nm-class process. Those processors employ 16-core chiplets and scale up to 64 cores in quad-chiplet configurations, with thermal design power reaching as high as 300W. For workstations, Loongson already offers the 3D5000 family with up to 32 cores running at 2.0 GHz, giving a clear sense of how its multi-chiplet strategy has evolved.
For 3D7000, Loongson says it has begun IP design work for advanced X-nanometer nodes, including key building blocks such as phase-locked loops, multi-port register files, and physical layers for modern interfaces. Native support for DDR5 memory and PCIe 5.0 is part of the plan, aligning the platform with current-generation server interconnect and memory standards.
Packing 32+ cores per chiplet is an ambitious play that echoes broader industry trends toward higher-density compute tiles. In the competitive landscape, next-generation architectures from other vendors are expected to offer both classic and dense variants of compute dies, with the dense options pushing core counts sharply upward for the server market. While Loongson has not shared specifics about architecture, SKUs, clock speeds, cache designs, or power targets for 3D7000, the move to a sub-10nm node and a 32+ core chiplet strategy suggests a strong emphasis on throughput and scalability.
Loongson’s roadmap isn’t limited to CPUs. The company also confirmed progress on its 9A1000 discrete GPU—an entry-level graphics solution aimed at AI PC use cases. Driver enablement for Windows is underway, and the GPU has recently been submitted for tape-out, with availability planned for the coming year. Together, the 3D7000 CPUs and 9A1000 GPU are positioned to play a larger role in China’s domestic computing ecosystem, where demand for locally developed hardware continues to rise.
Key takeaways for buyers and builders watching Loongson’s server platform evolution:
– 3D7000 targets a 2027 introduction on a sub-10nm node.
– New chiplets to feature 32 or more cores, doubling density over the current 16-core chiplets.
– Planned support for DDR5 and PCIe 5.0, with IP work already in progress.
– Current 3C60000 series scales to 64 cores in quad-chiplet form at up to 300W TDP.
– 3D5000 workstation CPUs offer up to 32 cores at 2.0 GHz.
– 9A1000 discrete GPU, focused on AI PC workloads, is approaching availability with Windows driver support.
As the timeline progresses, expect more clarity on architecture details, memory configurations, I/O counts, and performance metrics. For organizations interested in domestically produced server hardware and AI PC components, Loongson’s next wave of products could become a compelling option over the next few years.
