TSMC and Samsung are in a race to debut 2nm technology, but Japan is quietly emerging as a contender with Rapidus making strides in advanced lithography. Recently, the company began its trial production of the 2nm process and is working on scaling up its operations. However, challenges loom, similar to Samsung’s struggles with their 3nm GAA process. Experts suggest that Rapidus has a tight deadline of two years to initiate full-scale production to keep Japan competitive.
By 2027, Rapidus aims to achieve mass production of 2nm technology. Should they falter, experts warn that Japanese semiconductor firms might relocate overseas, risking Japan’s competitive edge.
To boost its production capabilities, Rapidus installed EUV machines last December—crucial for mass-manufacturing advanced wafers. By July 18, the company showcased its first prototype, marking significant progress toward becoming a key player in the semiconductor industry. The Japanese government has played a vital role, backing Rapidus with supportive policies and a substantial investment of 1.7 trillion yen (about 12 billion USD). This year alone, they expect to receive an additional 100 billion yen (around $677.6 million), fueling their ambition.
Despite these resources, Rapidus faces the possibility of failure. Hideki Wakabayashi, a professor at Kumamoto University and a member of Japan’s Semiconductor and Digital Industry Strategy Committee, warns that failure could drive Japan’s semiconductor companies to continue their ventures abroad, diluting the country’s technological advantage.
Establishing operations overseas could offer Rapidus benefits, such as hiring skilled personnel at competitive costs and accessing supportive foreign policies. Nations eager to host such advanced companies might offer attractive incentives and favorable conditions.
Nevertheless, with robust governmental support, Rapidus is well-positioned to tackle these challenges head-on and make significant contributions to Japan’s standing in the semiconductor arena.
