Gudeng Expects Strong Advanced Packaging Growth From 2027 as AI and HPC Demand Accelerates
The global semiconductor industry is entering another major growth phase as artificial intelligence and high-performance computing continue to reshape demand for advanced chips. With AI servers, data centers, cloud infrastructure, and next-generation computing platforms requiring more powerful and efficient semiconductors, chipmakers are pushing aggressively into advanced manufacturing processes and advanced packaging technologies.
Gudeng chairman Bill Chiu said on August 31, 2026, that the company expects its advanced packaging business to deliver double-digit revenue growth starting in 2027. The forecast reflects rising global demand as semiconductor companies expand capacity to support AI, HPC, and other performance-driven applications.
Advanced packaging has become increasingly important as the industry looks beyond traditional chip scaling. As cutting-edge nodes become more complex and expensive, packaging innovation plays a key role in improving performance, reducing power consumption, and enabling higher levels of chip integration. Technologies such as chiplet designs, 2.5D packaging, and 3D integration are becoming essential for processors used in AI training, inference, high-end computing, and data-intensive workloads.
Gudeng is positioned to benefit from this shift as semiconductor manufacturers increase investment in both front-end and back-end process capacity. The company’s outlook suggests that demand momentum is not limited to short-term AI excitement, but is part of a broader technology upgrade cycle across the global chip supply chain.
The expected revenue growth from 2027 also points to a new wave of semiconductor expansion. Major chip producers are preparing for stronger demand from cloud service providers, enterprise AI adoption, autonomous systems, advanced networking, and next-generation consumer devices. As these markets grow, advanced packaging capacity is becoming a critical bottleneck and a key area of investment.
Bill Chiu’s comments underline the confidence surrounding the semiconductor equipment and materials ecosystem. As AI and HPC applications continue to require faster, more efficient, and more densely integrated chips, suppliers connected to advanced packaging are likely to see stronger business opportunities in the coming years.
With AI infrastructure spending showing no signs of slowing, Gudeng’s advanced packaging business could become an important growth driver from 2027 onward. The company’s expectation of double-digit revenue gains highlights how central advanced packaging has become to the future of semiconductor innovation.
