Qualcomm is ahead of the game, already diving deep into the development of its next-generation Arm-based Snapdragon X2 CPUs for PCs. The latest leap forward, dubbed “SC8480XP” and known internally as “Project Glymur,” has reportedly been put through its paces in recent tests.
Launching the Qualcomm Snapdragon X series earlier this year generated substantial buzz, particularly with promises of a stellar AI-driven PC experience powered by robust CPU and GPU combinations. Despite the initial excitement, early performance reviews painted a mixed picture. Key strengths highlighted included impressive IPC improvements, single-core performance, and efficiency, particularly in battery life. However, the multi-core and graphics performance left some room for desire. Nevertheless, Qualcomm offered a versatile range of solutions across various price points, featuring 12, 10, and most recently, 8-core SoCs within its X Elite and X Plus families.
The first-generation Snapdragon lineup introduced the Oryon core architecture, and we’ve recently seen an intriguing die shot offering a closer glimpse at this technology.
Since then, competitors like AMD and Intel have stepped up with formidable offerings, such as the Ryzen AI 300 “Strix” and Core Ultra 200V “Lunar Lake” SoCs, both boasting enhanced NPUs, powerful CPU cores, and top-notched integrated GPUs. This intensifying competition seems to have spurred Qualcomm to push further, building on the initial momentum of the Snapdragon X family and moving swiftly to test the next-gen Snapdragon X2 SoCs.
Winfuture has reported that these cutting-edge Snapdragon X2 SoCs have been in testing for some time. The internal databases reveal the SC8480XP SOCs, under the codename “Glymur,” underwent evaluations in July and August, specifically in Q3 2024. For context, the current generation units bear the model number “SC8380XP” and are known as “Hamoa.”
Interestingly, Qualcomm is still in the early testing stages for these next-gen SoCs, utilizing development boards equipped with varying configurations of NAND and memory components. This allows for sample testing before locking down official specifications, a process common with early evaluation platforms or RVPs/EVPs.
An earlier Dell XPS leak confirmed that Qualcomm is crafting at least two upcoming variants of the Oryon CPU architecture, set to feature in Snapdragon X-based AI PCs. The Snapdragon X V2 is targeted for a mid-2025 release, with the successor, the Snapdragon X V3, expected later, around Q4 2027. While these timelines are preliminary, a leak from a major partner like Dell lends credence to the active development of these new SoCs.
Moreover, there’s buzz about an entry-level addition to the Snapdragon X Plus lineup in the works, indicated by the model “X1P-24-100.” While it’s expected to maintain an 8-core design, it might feature lower clock speeds or GPU performance, providing a more budget-friendly option.
Ultimately, it’s an exciting time for Qualcomm and its Snapdragon X lineups. As they refine and enhance these technologies, we eagerly anticipate how they will shape the future of PC performance and AI integration.
