Xiaomi is gearing up to make a splash in the smartphone market with its very first self-developed system-on-chip (SoC), which has successfully reached a crucial stage known as ‘taping out’ in an unspecified 3 nm node. This exciting development suggests that mass production is on the horizon, potentially leading to a launch next year.
Earlier rumors hinted at Xiaomi’s ambitions to launch an in-house smartphone SoC, indicating it might rival the performance of the Snapdragon 8 Gen 1 and be built on TSMC’s advanced N4P node. The latest reports, however, spotlight a different undertaking—a 3 nm smartphone application processor (AP) from Xiaomi. While the specifics of the node remain unclear, speculation suggests a TSMC node, possibly the N3E.
A successful tape-out is a critical milestone, serving as an indicator that the chip could be ready for markets next year. Although detailed specifications about the CPU core configuration, GPU, or other components remain under wraps, more information is expected as the launch date nears.
Being a first-generation product, the SoC might feature stock ARM cores paired with a Mali GPU. Interestingly, the 5G modem is slated to be sourced from UNISOC. This choice could hint at its initial placement in devices like tablets or mid-range smartphones, rather than the flagship Xiaomi models such as the Xiaomi 16.
Xiaomi enthusiasts and tech aficionados will be eagerly awaiting further news, as the launch of this SoC could mark a significant step in the tech giant’s strategic expansion into semiconductor development. The coming months are likely to unveil more about this intriguing project, keeping the anticipation high across the tech community.
