Recent discussions have stirred around the idea of AMD developing a new Ryzen 9000X3D CPU featuring dual X3D chiplets. Initially, this seemed exciting as it was rumored to surpass the L3 cache of the existing Ryzen 9 9950X3D, boosting it to a total of 192 MB. However, new insights suggest this may not be happening after all.
According to a trusted leaker on Chiphell forums, the notion of a “Dual X3D” Ryzen 9000X3D CPU might be unfounded. The evidence backing this claim is weak, and experts believe that such a CPU doesn’t currently exist. Despite this, whispers about a new X3D Ryzen 9000 chip persist, hinting at a possible sibling to the Ryzen 7 9800X3D. This could potentially be the Ryzen 7 9700X3D, sharing specifications with the 9800X3D but possibly featuring a lower TDP due to slower clock speeds.
If released next year, this rumored CPU is expected to offer competitive gaming performance comparable to the 9800X3D. Interestingly, adding another X3D chiplet to the Ryzen 9 9950X3D would likely yield only around a 4% performance improvement, which doesn’t economically justify the cost of integrating a second chiplet.
Currently, the existing Ryzen 9800X3D and 9950X3D models perform exceptionally well with just one X3D CCD. The slight performance gain from dual X3D configurations could be negligible, especially since it might adversely affect applications sensitive to latency. The promise of dual X3D CPUs might be more suitable for future Zen 6 lineups, but as it stands, it seems impractical for the Ryzen 9000 series.
