FEVM is said to be working on a new ultra-portable mini PC prototype that’s so small it barely looks like a computer at all. The device is reportedly under 2 cm thick, yet it’s expected to pack surprisingly capable hardware and a modern set of connectivity options—aiming to deliver real PC performance in a form factor closer to a large external drive than a traditional mini PC.
According to a leak from @94G8LA, this FEVM prototype will use an Intel Panther Lake processor rated at 55W. If that detail holds up, the most likely match would be entry-level Core Ultra Series 3 chips, with models such as the Core Ultra 5 335, Ultra 5 332, or Ultra 5 322 being suggested candidates. A 55W Panther Lake configuration in an ultra-thin chassis could make this an interesting option for users who want a compact workstation-style setup without stepping down to low-power embedded CPUs.
Cooling is usually the biggest challenge for a PC this thin, especially with a higher-wattage processor. While the cooling hardware isn’t obvious from the top, the same leak claims FEVM is using a dual-fan cooling system, likely positioned on the underside. If accurate, that would help explain how the company expects to maintain performance in such a tight space, where heat buildup and throttling are common problems.
Connectivity is another area where the rumored specs stand out. The device is said to include multiple USB ports with both Type-A and Type-C options. It’s also rumored to feature two Thunderbolt 4 ports, which could make it a strong candidate for flexible desk setups—supporting high-speed storage, docks, and display connectivity through a single cable. On top of that, it reportedly supports up to 100W power delivery for charging other devices, adding extra utility for travelers and mobile workstations.
Storage expandability is unusually ambitious for something this thin. The leak claims three M.2 slots for NVMe SSDs, including one PCIe Gen 5.0 x4 slot and two PCIe Gen 4.0 slots. One of the Gen 4.0 connections is said to be a full x4 interface paired with an OCuLink adapter, while the other runs at Gen 4.0 x2 speeds. If FEVM manages to deliver this configuration in a production model, it could appeal to users who want fast internal storage options for creative work, software development, or compact home lab builds.
Networking may be the most surprising part of the rumored feature list. The prototype is said to include dual LAN ports, offering both 10GbE and 2.5GbE. Dual Ethernet in an ultra-compact mini PC can be attractive for advanced users building portable routing, virtualization, network testing, or small server setups—especially when combined with multiple NVMe drives.
In terms of size, the device is rumored to measure about 169 x 108 x 19 mm. That makes it far easier to carry than most conventional mini PCs, and potentially small enough to slip into a loose pocket or small pouch for on-the-go setups. While the concept looks promising, key details still aren’t known, including the memory configuration, final retail pricing, and how closely the finished product will match the leaked prototype specs.
If FEVM brings this Panther Lake-based ultra-thin mini PC to market with the reported dual-fan cooling, Thunderbolt 4, three M.2 slots, and dual LAN networking, it could become one of the more interesting compact PC options for 2026—especially for users who want high-end connectivity and storage flexibility without carrying a full-sized desktop replacement.
