China faces challenges in high-bandwidth memory (HBM) and advanced chip technologies, as international sanctions on state-of-the-art process nodes hinder domestic semiconductor advancements. Despite these obstacles, Chinese researchers are exploring innovative solutions, particularly in processing-in-memory technology. This approach could help bypass some of the existing restrictions and foster progress in their semiconductor industry. By leveraging these innovations, China aims to carve a new path in chip development and gradually overcome the limitations imposed by global trade barriers.
